As a follow up to my posting last week on measuring test coverage, which you can read from the following link:
I would like to hear from test and process engineers on what types of equipment form part of your test and inspection strategy. How do In-Circuit test (ICT), Flying Probe Test (FPT), Automated Optical Inspection (AOI), Automated X-Ray Inspection (AXI), Boundary Scan Test (BST), Functional Test (FT) play a role in your test and inspection strategies. How are you combining these different test methods to achieve optimal test coverage? Also, if you are willing to share it, what vendor equipment do you use? Is it Agilent, Teradyne, Viscom, VI Technology, YesTech, Asset Intertech, Goepel, for example, there are many others. Are you using Boundary Scan a great deal and how much coverage you are able to achieve with this technique and are you combining it with for example ICT or FPT?
What are the biggest challenges you are seeing being able to achieve an adequate level of coverage on today’s printed circuit boards.