Posts tagged with 'aperture'
Hi there
As the next installment of the new capability in Valor MSS 11.3, I shall today talk about the improvements we have made in the Stencil Design module of the product.
We added a number of new standard apertures to the Stencil Design with this release. These were specifically to address commonly created stencil openings that were previously challenging to create quickly. Now they are automatically … Read More
solder paste, stencil, aperture, vPlan, data preparation, BOM
Hi there
I have heard of a couple of cases of PCB designs where a common pad is shared between two separate components. At it’s simplest case, two 0603 components lie end to end but instead of four pads, two for each, there are only three in total. The two pads closest to each other overlap meaning only one is visible on the board. In other words they share a common pad.
This scenario is typically … Read More
packages, aperture, vPlan, ICT, programming, bill of materials, stencil, variant, BOM
Hi there
Last week I discussed the new capability in Valor MSS Process Preparation 11.3. I mentioned that I would go in to more detail on some of the areas that are part of this version and I will start with our new capability for inspection machines.
There are three main types of automated inspection machines, Automated Optical Inspection (AOI), Automated X-Ray Inspection (AXI) and Solder Paste Inspection … Read More
data preparation, AOI, aperture, Solder Paste Inspection, SPI, stencil, Automated X-Ray Inspection, AXI, process, Automated Optical Inspection
Dear all
I am requesting your input on a hot topic within the Valor Process Engineering team this week. Namely how to calculate the aspect ratio and area ratio for stencil apertures. Now from my research so far, the most common measure of whether the aperture will release correctly has typically been the aspect ratio, however this seems to be calculated easily in simple cases of rectangles and circles. … Read More