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PCB Manufacturing, Assembly & Test Blog

Posts tagged with 'ICT'

3 Apr, 2014

Mark Laing Hi there It was a great three days in Las Vegas last week for the IPC Apex Trade Show. We met many new and existing customers at our booth. The attendance seemed to be higher than last year though I don’t know the official numbers. I presented at the PCB Designers Forum on the Monday morning on simplying all those part and package libraries that you need to manage. This was also one of the areas … Read More

IPC Apex, ICT, AOI, apex, testability, vPlan, process, BOM, data preparation, process preparation, stencil, bill of materials

27 Feb, 2014

Mark Laing Hi there IPC Apex 2014 in Las Vegas is only a few weeks away, being the week of March 23rd. I'll be presenting at the PCB Designers Forum on the morning of Monday 23rd and then be attending the Exhibition for the following days at Booth 617. I hope you will be able to make the trip to Las Vegas and attend the show and the presentations. If so please stop by our booth and introduce yourself so we can … Read More

Las Vegas, IPC Apex, Design For Test, vPlan, ICT, process, documentation, programming, Exhibition

18 Dec, 2013

Mark Laing Hi there We have just posted 12.0 Update 1 to SupportNet for those users who have already downloaded and installed 12.0 which came out a few weeks ago. This update includes the first release for the IPC 2581 Revision A format as a CAM reader in Process Preparation. Although not common, we have had some requests to support this format so we have released this now as part of the Process Preparation suite. For … Read More

programming, process, data preparation, Design For Test, spea, IPC 2581, testability, vPlan, ICT

18 Jun, 2013

Mark Laing Hi there I have had many conversations with manufacturing people over the years regarding the various files that are created from design that are provided to them for the purposes of assembly and test. It is not unusual to hear about a file set consisting of Gerbers, Drill, IPC 356 Netlist, Centroid, BOM, Intelligent layout, various documentation files and other machine specific format files that continue … Read More

process, Automated Optical Inspection, mixed vendor, ODB++, documentation, BOM, Flying Probe, ICT, Automated X-Ray Inspection, bill of materials, Design For Test, data preparation, programming, vPlan

11 Jun, 2013

Mark Laing Hi there Boundary Scan has been available for well over 15 years now and it has continued to evolve over that time as the initial IEEE standard 1149 has been updated to cover more than just digital devices. Although for most printed circuit designs full testing through 4 or 5 connections is not possible a significant number of designs have some number of components on them that support the Boundary … Read More

ICT, Flying Probe, testability, vPlan, boundary scan, process, Design For Test, programming, data preparation

2 Apr, 2013

Mark Laing Hi there One of the areas that we constantly look to enhance with each release is our support for the machines that are in use with our customers. Although we use the Mentor Ideas site as a opportunity to derive feedback from yourselves, I also wanted to take this chance to ask you to let me know which machines you still need us to support either because they are new to the market or needed to address … Read More

AOI, Enhancement, Flying Probe, ICT, AXI, data preparation, bill of materials, Design For Test, Automated Optical Inspection, Automated X-Ray Inspection, documentation, boundary scan, BOM, process, vPlan, SPI, THT, Solder Paste Inspection, programming

19 Mar, 2013

Mark Laing Hi there I have heard of a couple of cases of PCB designs where a common pad is shared between two separate components. At it’s simplest case, two 0603 components lie end to end but instead of four pads, two for each, there are only three in total. The two pads closest to each other overlap meaning only one is visible on the board. In other words they share a common pad. This scenario is typically … Read More

packages, aperture, vPlan, programming, ICT, bill of materials, stencil, variant, BOM

5 Mar, 2013

Mark Laing Hi there We recently had a successful trade show at Apex 2013 in San Diego. During the event I was interviewed with iConnect PCB007′s Andy Shaughnessy. We discussed the main themes that we were promoting on the booth in the area of Process Preparation, namely being able to use a single solution for all areas of PCB manufacturing data preparation as well as simplying the many types of part library … Read More

IPC, vPlan, AOI, documentation, Flying Probe, ICT, AVL, data preparation, AXI, Design For Test, Automated Optical Inspection, Automated X-Ray Inspection, BOM, bill of materials, testability, SPI, Solder Paste Inspection, programming, process

26 Feb, 2013

Mark Laing Hi there I recently discussed the new capability in Valor MSS Process Preparation 11.3. I mentioned that I would go in to more detail on some of the areas that are part of this version and I will cover the new Test Probe Placement capability today. We have added an all new Test Probe Placement Session in 11.3 that performs the physical test probe placement analysis natively within the application. This … Read More

AOI, Flying Probe, ICT, AXI, data preparation, bill of materials, Design For Test, Automated Optical Inspection, Automated X-Ray Inspection, boundary scan, BOM, process, vPlan, testability, VPL

21 Feb, 2013

Mark Laing Hi there The Valor team are here in San Diego at the IPC Apex Trade Show. We’ve had a great couple of days, meeting our customers, plenty of new ones as well as meeting with some of the other vendors at the show. Our theater presentations have been well received, bringing people in to the booth and then stopping afterwards, asking questions and looking for more information. If you are at the show … Read More

Enhancement, documentation, programming, Solder Paste Inspection, AOI, Design For Test, SPI, apex, stencil, testability, Automated Optical Inspection, VPL, BOM, Automated X-Ray Inspection, vPlan, boundary scan, approved vendor list, data preparation, AXI, AVL, bill of materials, Flying Probe, Planning, mixed vendor, OIB, IPC, ICT

4 Feb, 2013

Mark Laing Hi there We have just released a new version of Valor MSS (11.3) that brings a number of significant enhancements to existing customers as well as those looking to invest in cutting edge process preparation solutions. I’ll be covering some of these enhancements in more detail in future blogs but here is a short summary of some of the new capability that we have in 11.3. We have made significant … Read More

OIB, mixed vendor, vPlan, AOI, Flying Probe, ICT, BOM, AVL, documentation, bill of materials, Enhancement, Design For Test, data preparation, VPL, testability, stencil, programming, Planning, process

29 Jan, 2013

Mark Laing Hi there Next month on February 19th, 20th and 21st is the annual IPC Apex Convention in San Diego and there will be more than 400 exhibitors from 50 different countries represented at the show. Here are five reasons you should attend: 1. The Valor Division of Mentor Graphics will be exhibiting at booth 1227. So, you will be able to meet the U.S. sales team as well as some of the Product Line personnel … Read More

mixed vendor, AOI, Flying Probe, apex, ICT, IPC, bill of materials, BOM, approved vendor list, documentation, data preparation, Design For Test, vPlan, stencil, Sequence, programming, san diego, process

27 Nov, 2012

Mark Laing Hi there I have talked to a number of users who are asking for capability to manage the Process Preparation needs of multiple locations around the world. I would like to hear from you on what requirements you consider important to this discussion. For example we have some customers running a single database across multiple locations allowing them to share data across all their facilities. One downside … Read More

programming, ICT, AVL, multi-site, data preparation, documentation, bill of materials, Flying Probe, BOM, Design For Test, database, server, testability, vPlan

20 Nov, 2012

Mark Laing Hi there It has been a few months since we launched the World Class Process Preparation Webinar including a video of an overall product demonstration. Over the past couple of months I have met with a number of people who implemented the Valor MSS Process Preparation solution and are achieving the efficiencies and improvements that we describe in the Webinar. Therefore I would like to provide you with … Read More

mixed vendor, AOI, Flying Probe, ICT, BOM, boundary scan, AVL, bill of materials, documentation, data preparation, Design For Test, vPlan, Planning, testability, VPL, stencil, programming, process

6 Nov, 2012

Mark Laing Hi there I have been posting comments on my blog now for a number of months. The topics have been based on the feedback and conversations I’ve had with many users of Process Engineering software, both Mentor Graphics and non-Mentor Graphics products, all around the world. Many of you have also taken the time to add comments on these postings which I really appreciate. I’d like to open up … Read More

mixed vendor, AOI, Flying Probe, ICT, BOM, boundary scan, AVL, bill of materials, documentation, data preparation, Design For Test, Planning, testability, vPlan, stencil, programming, process

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