PCB Manufacturing, Assembly & Test Blog

Hi there I have heard of a couple of cases of PCB designs where a common pad is shared between two separate components. At it’s simplest case, two 0603 components lie end to end but instead of four pads, two for each, there are only three in total. The two pads closest to each other overlap meaning only one is visible on the board. In other words they share a common pad. This scenario is typically … Read More

packages, aperture, vPlan, ICT, programming, bill of materials, stencil, variant, BOM

Okay, well maybe that is a little bit of an exaggeration but there are still many ways to leverage the manufacturer specific package data from the VPL throughout the Process Engineering flow. As a follow up to my last posting I mentioned that I would be talking about the creation and use of manufacturer specific packages. Through the use of the VPL, manufacturer specific packages can be downloaded … Read More

packages, AVL, approved vendor list, bill of materials, VPL, BOM