PCB Manufacturing, Assembly & Test Blog

Hi there One of the least efficient areas in PCB assembly concerns the creation and management of package data that will be consumed across the shop-floor. For example DFM processes rely on accurate package data to determine component to component spacing issues or using accurate pin terminus contact data to ensure that solder joints will form correctly. Accurate package data is critical for DFT analysis … Read More

programming, AOI, bill of materials, mixed vendor, process, documentation, data preparation, Design For Test, Flying Probe, ICT, BOM, VPL, vPlan, stencil, testability

Hi there Within the Valor MSS Process Preparation suite, we have the best DFA capability that exists in the market. There are a number of checks that are performed that are necessary for PCB assemblers to execute prior to starting a design in production. Being able to know if fiducials on the board are near similar pads or vias is important to ensure that placement and inspection equipment don’t … Read More

Flying Probe, bill of materials, testability, vPlan, ICT, Design For Test, BOM, data preparation

Hi there Test Engineers are typically given the requirement to get 100% of nets probed at electrical test with the thinking that this delivers 100% testability. Unfortunately 100% accessibility is not the same as 100% testability. There are a number of reasons why this is not the case but here is a easy one. Typical boards contain integrated circuit (IC) components and power supplies. These power supplies … Read More

programming, data preparation, Design For Test, ICT, testability, Flying Probe