The electronics industry is experiencing an increase in the use of Light Emitting Diodes (LEDs) in a growing number of products. The lower power consumption, smaller size and longer life make LEDs an attractive alternative to standard light sources. However, discrete LED arrays used in signs and displays pose significant challenges for PCB manufacturing. The inherent variations in brightness levels and color temperatures become noticeable when many LEDs are mounted together in close proximity in an array. As a result surrounding circuitry must be adjusted, often on a PCB by PCB basis, to ensure uniform performance. This paper describes these challenges in detail and presents the Valor LED Binning Management solution as an off the shelf offering that addresses the challenges.