Xpedition® Package Integrator
Enable co-design across IC packaging and PCB domains to radically increase productivity
- Connectivity management
- Plane generation support
- Complete IC-Package-PCB interconnect path optimization
- 3D, full-wave EM analysis
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Behind the Design: Qualcomm Technologies Inc.
This is the fourth post in a series showcasing the winners of the 2014 Technology Leadership Awards. View the previous ones here. First place winner in the Consumer Electronics & Handheld category:...
- Analog Designer Analog Simulation Analog Designer Analog SimulationHsinchu City, TW • http://www.mentor.com/training/courses/analog-designer-analog-simulationMar 18
- CES for Expedition PCB CES for Expedition PCBMeudon, FR • http://www.mentor.com/training/courses/ces-for-expedition-pcbJan 19–20 CES for Expedition PCBMeudon, FR • http://www.mentor.com/training/courses/ces-for-expedition-pcbMar 11–12