Learn about the industry challenges that drove our implementation of the Xpedition VX release, as well as some product highlights.
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This is the second post in this routing series. View the introduction post here. To increase fabrication yield, it is important to center the traces between the fanout vias inside the BGA area. Large BGAs…View Blog Post
- RF Design in DxD/Expedition RF Design in DxD/ExpeditionOnline • http://www.mentor.com/training/courses/rf-design-in-dxdexpeditionApr 16–17
- CES for Expedition PCB CES for Expedition PCBMarlborough, MA • http://www.mentor.com/training/courses/ces-for-expedition-pcbApr 17–18 CES for Expedition PCBOnline • http://www.mentor.com/training/courses/ces-for-expedition-pcbMay 6–9