HyperLynx® Thermal analyzes board-level thermal conditions on placed, partially routed, or fully routed PCBs. It simulates conduction, convection and radiation, and produces temperature profiles, gradients, and excess temperature maps, resolving board and component overheating early in the design process.
By adjusting the design using what-if scenarios, engineers and PCB designers can reduce mean time between failures by as much as 50 percent, improving product quality and ultimately decreasing warranty costs.
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Find component and PCB hot spots quickly and efficiently
HyperLynx Thermal enables effective “what-if” analysis on component placement, stack-up design, and mechanical cooling techniques
Full thermal analysis
Analyze all major heat-transfer mechanisms, including convection, conduction, and radiation
Understand what impacts board temperatures
HyperLynx Thermal allows engineers to simulate thermal and power integrity analysis, enabling better understanding of the effect of power distribution network current densities on board temperatures