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HyperLynx Thermal

Fast, accurate 3D modeling and simulation of thermal impact of PCB placement and routing


A large number of Mentor Graphics users are in the Space/Avionic industries. These industries include satellites, space stations, airplanes, and missiles. The board relies upon thermal screws and wedge locks at the upper and lower edges to conduct the heat to the sink. Thermal radiation is also very important in these designs.


Control High reliability is a demand in these industry segments where large numbers of complex boards are encountered. Heat sinks have been used to cool some components. ECAD interfaces give a perfect translation of component placement, and library information to speed the setup process for these densely packed boards.


These boards frequently have a few components, such as CPUs, with high power dissipation. The boards are usually very large with many components. Chip fans, heat sinks, or local impingement jets are used along with strong forced convection as cooling methods. Again, the ECAD interface is essential for these boards because of the vast number of components.


In many automotive applications, high currents pass through heavy traces on the board and generate significant heat. A Trace Version of HyperLynx Thermal is available for these types of special boards. The hot traces are modeled on the board using a power density factor.

Power Supplies

Power supplies have many tall components that generate significant amounts of power. These components also create air flow blockage effects which could be severe. For example, although the transformer has high power, its temperature is low due to the large surface area. The hot components are the ones with medium power and medium size.

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