- Import and analyze single-sided, double-sided, and multi-layer boards with irregular shapes and reference-plane discontinuities
- Boards and daughter cards can be placed near the edge or interior of a cabinet, and moved during “what-if” analysis
- Snapshot full PCB temperature profiles, including conductive, radiative and convective heat transfer to develop viable solutions for component overheating
- Accuracy within +/- 10%
- Improves reliability predictions with precise calculation of junction temperatures
- Finite difference schemes computed with self-adaptive locally refined meshes, producing extremely fast yet accurate results
- Quickly analyze component temperature constraint violations across the entire board, alerting engineers to potential trouble spots such as stress-inducing temperature gradients
- Ships with a large set of fully defined PCB components; create your own component models in a matter of seconds
HyperLynx Power Integrity
Accurately model power distribution networks and noise propagation mechanisms throughout the PCB design process
HyperLynx Signal Integrity
HyperLynx SI, generates fast, easy and accurate signal integrity analysis for PCB systems design.
Xpedition xPCB layout combines ease-of-use with advanced functionality, providing designers with the technology to create the most complex designs.