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HyperLynx Thermal

Fast, accurate 3D modeling and simulation of thermal impact of PCB placement and routing

Technical Specifications

  • Import and analyze single-sided, double-sided, and multi-layer boards with irregular shapes and reference-plane discontinuities
  • Boards and daughter cards can be placed near the edge or interior of a cabinet, and moved during “what-if” analysis
  • Snapshot full PCB temperature profiles, including conductive, radiative and convective heat transfer to develop viable solutions for component overheating
  • Accuracy within +/- 10%
  • Improves reliability predictions with precise calculation of junction temperatures
  • Finite difference schemes computed with self-adaptive locally refined meshes, producing extremely fast yet accurate results
  • Quickly analyze component temperature constraint violations across the entire board, alerting engineers to potential trouble spots such as stress-inducing temperature gradients
  • Ships with a large set of fully defined PCB components; create your own component models in a matter of seconds
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