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Using Advanced PCB Technologies to Gain a Competitive Edge in Circuit Design

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Overview

When the going gets tough, advanced technologies can give you a competitive edge. With more advanced technology, the potential gains are huge – but so are the stakes if things don’t turn out as planned.

What designers need are tools that help bridge the technology gap and promote a correct-by-design methodology, even when the design involves fine-pitch HDI, flex-rigid, chip on board, integrated wireless, and embedded active and passive parts.

This session will explore the range of advanced PCB technologies available today, and show how the Xpedition Enterprise flow puts you in the driver's seat for first-turn success.

What You Will Learn

  • Trends in advanced PCB assembly technologies
  • Integrated tools that eliminate the need for workarounds when dealing with exotic technologies
  • Time, size, and quality benefits achieved when your tools match the PCB technologies you have to build

About the Presenters

Presenter Image Per Viklund

Per Viklund is Director of RF & IC Packaging at Mentor Graphics. He is a long time IEEE & IMAPS member with 30 years experience in electronic design automation, and over 20 years designing with advanced EDA tools. Prior to joining Mentor Graphics in 2003, Viklund was Chief Technical Manager of DDE-EDA for 10+ years.

Presenter Image John Isaac

John Isaac is director of market development at Mentor Graphics and is currently responsible for worldwide market development for the Systems Design Division.  He has worked in the Electronic Design Automation (EDA) industry with PCB and IC technology for more than forty years.  Since joining Mentor Graphics, Isaac has held marketing positions in both PCB and IC product areas.

Who Should View

  • PCB design managers wanting to maintain team efficiency while leveraging advanced PCB assembly technologies
  • PCB designers seeking design aids to improve their productivity

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