Sign In
Forgot Password?
Sign In | | Create Account

Using Advanced PCB Technologies to Gain a Competitive Edge in Circuit Design



When the going gets tough, advanced technologies can give you a competitive edge. With more advanced technology, the potential gains are huge – but so are the stakes if things don’t turn out as planned.

What designers need are tools that help bridge the technology gap and promote a correct-by-design methodology, even when the design involves fine-pitch HDI, flex-rigid, chip on board, integrated wireless, and embedded active and passive parts.

This session will explore the range of advanced PCB technologies available today, and show how the Xpedition Enterprise flow puts you in the driver's seat for first-turn success.

What You Will Learn

  • Trends in advanced PCB assembly technologies
  • Integrated tools that eliminate the need for workarounds when dealing with exotic technologies
  • Time, size, and quality benefits achieved when your tools match the PCB technologies you have to build

About the Presenters

Presenter Image Per Viklund

Per Viklund is Director of RF & IC Packaging at Mentor Graphics. He is a long time IEEE & IMAPS member with 30 years experience in electronic design automation, and over 20 years designing with advanced EDA tools. Prior to joining Mentor Graphics in 2003, Viklund was Chief Technical Manager of DDE-EDA for 10+ years.

Presenter Image John Isaac

John Isaac is director of market development at Mentor Graphics and is currently responsible for worldwide market development for the Systems Design Division.  He has worked in the Electronic Design Automation (EDA) industry with PCB and IC technology for more than forty years.  Since joining Mentor Graphics, Isaac has held marketing positions in both PCB and IC product areas.

Who Should View

  • PCB design managers wanting to maintain team efficiency while leveraging advanced PCB assembly technologies
  • PCB designers seeking design aids to improve their productivity

Related Resources


Modeling Signal Discontinuities in SERDES Channels: Minding the Details without Breaking a Sweat

This webinar will go through the basic steps of creating 3D models for common PCB structures, and then using these models to analyze a high speed serial channel.…View On-demand Web Seminar

The Need for Speed and Accuracy: Techniques and Tools for Modern Signal-Integrity Analysis

This session will discuss the advanced techniques required for modern SI analysis, ranging from high-throughput batch simulation of memory interfaces to IBIS-AMI modeling of SERDES channels to 3D-electromagnetic...…View On-demand Web Seminar

Analyzing DDR2/3/4 Memory Interfaces: Guarantee Your Margins Before You Build and Ship Boards

This session will explain the use of HyperLynx’s DDRx Wizard, and preview its upcoming support for the new DDR4 standard.…View On-demand Web Seminar

Other Related Resources

High-Speed PCB Layout: Physical Design Issues of High-Speed Interfaces

White Paper: Moore’s law, applied to data rates, has pushed PCB circuits so fast that the layout becomes part of the circuit. In designs such as DDR3 and PCIe, the fastest memory and high-speed serial performance...…View White Paper

Advanced PCB Techniques: How To Use the Latest Technologies

White Paper: Every electronic product design has many challenges associated with the project. Often, the real challenge comes as an afterthought, perhaps the last line of the requirements document: “… and...…View White Paper

Understanding Via Effects

White Paper: As the demand for fast computation and information transmission has increased dramatically in recent years, many designs have boards with signals operating in the multiple-Gbps range. Advanced memory designs...…View White Paper

Online Chat