Sign In
Forgot Password?
Sign In | | Create Account

Modeling Signal Discontinuities in SERDES Channels: Minding the Details without Breaking a Sweat



High-data-rate SERDES links are appearing in droves on PCBs of all types — yet the associated signals contain frequency components well into the multi-GHz range, meaning that structures like vias, connectors, and BGA breakouts all potentially introduce dangerous discontinuities into the channels. The only way to accurately model these effects is to use 3-D electromagnetic analysis, but how can it be done (especially by non-experts) without eating weeks and weeks of tedious analysis time and risking inaccurate results? In addition, how do I know which types of structures need 3-D models?

HyperLynx 3D EM is a full-wave 3D solver that can be used to easily extract physical structures from a PCB design and then generate models for use in frequency or time domain simulations.

This webinar will go through the basic steps of creating 3D models for common PCB structures, and then using these models to analyze a high speed serial channel.

What You Will Learn

  • The advantages of using HyperLynx 3D EM over other solutions
  • The types of problems that can be solved with HyperLynx 3D EM
  • The advanced features in the product
  • Applications where 3D analysis can be helpful
  • How to put a complete serial channel analysis together

Who Should View

  • Electrical Engineers involved in signal integrity analysis and board design
  • Engineering managers interested in learning about the types of problems HyperLynx 3D EM can solve

Related Resources


Microwave & RF Planar Filter Design Using FASTEM

This webinar will discuss microwave and RF filter design introduces the use HyperLynx 3D EM FASTEM for real-time EM modeling. Topics Include EM theory behind the design of a Marchand Balun and its application...…View On-demand Web Seminar

IC Package Design Optimization and Analysis for USB 3.0

This webinar will discuss IC Package design for USB 3.0 and will introduce important IC Package design considerations and effective USB PCB design techniques. Topics include: How to Design for PCIe Gen...…View On-demand Web Seminar

Controlling EMI in High-Speed Designs

Electromagnetic Interference (EMI) has become a much larger problem in recent years. Fast edge rates on signals, coupled with the proliferation of high volumes of low-cost electronic devices, have made...…View On-demand Web Seminar

Other Related Resources

HyperLynx 3D Analysis

Training Course: HyperLynx 3D Analysis course will help you gain the ability to accurately model and simulate discontinuities such as vias in PCBs in HyperLynx 3D EM environment.…View Training course

High-Speed PCB Layout: Physical Design Issues of High-Speed Interfaces

White Paper: Moore’s law, applied to data rates, has pushed PCB circuits so fast that the layout becomes part of the circuit. In designs such as DDR3 and PCIe, the fastest memory and high-speed serial performance...…View White Paper

Understanding Via Effects

White Paper: As the demand for fast computation and information transmission has increased dramatically in recent years, many designs have boards with signals operating in the multiple-Gbps range. Advanced memory designs...…View White Paper

Online Chat