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Modeling Signal Discontinuities in SERDES Channels: Minding the Details without Breaking a Sweat



High-data-rate SERDES links are appearing in droves on PCBs of all types — yet the associated signals contain frequency components well into the multi-GHz range, meaning that structures like vias, connectors, and BGA breakouts all potentially introduce dangerous discontinuities into the channels. The only way to accurately model these effects is to use 3-D electromagnetic analysis, but how can it be done (especially by non-experts) without eating weeks and weeks of tedious analysis time and risking inaccurate results? In addition, how do I know which types of structures need 3-D models?

HyperLynx 3D EM is a full-wave 3D solver that can be used to easily extract physical structures from a PCB design and then generate models for use in frequency or time domain simulations.

This webinar will go through the basic steps of creating 3D models for common PCB structures, and then using these models to analyze a high speed serial channel.

What You Will Learn

  • The advantages of using HyperLynx 3D EM over other solutions
  • The types of problems that can be solved with HyperLynx 3D EM
  • The advanced features in the product
  • Applications where 3D analysis can be helpful
  • How to put a complete serial channel analysis together

Who Should View

  • Electrical Engineers involved in signal integrity analysis and board design
  • Engineering managers interested in learning about the types of problems HyperLynx 3D EM can solve

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