Interconnect and I/O planning between the design teams for IC layout, package substrate design, and printed circuit board (PCB) layout is critical to driving down costs for the package and the PCB. Companies that recognize this fact are struggling to accomplish this task today with a combination of MS Excel, white board sketches, emails, and internal “glue-ware”. Often, cross-team meetings are held, but there is no central repository for all of the information and ideas that are exchanged. After the meeting ends, design team members go back into their individual silos and try to correctly recall and incorporate all that was discussed into their layout tool. This cycle repeats itself over and over in typical product release and is prone cross-team misunderstandings and human error.