Metric Pitch BGA and Micro BGA Routing Solutions
Furaxa, Inc., PADS Layout at 50 GHZ
Read how Joel Libove, Ph.D., President of Furaxa, Inc. creates ultra-high-speed boards with PADS.
PADS Advanced Packaging Demonstration: Designing with Bare Die Components
PADS advanced packaging allows you to design bare die components placed on laminated PCBs for chip-on-board or multi-chip modules with great ease. See how in this quick demo.