Featured Technology Overview
PADS Advanced Packaging Demonstration: Designing with Bare Die Components
PADS advanced packaging allows you to design bare die components placed on laminated PCBs for chip-on-board or multi-chip modules with great ease. See how in this quick demo.
Constraint Management in PADS
Ensure that your design meets and maintains timing and performance requirements using the PADS Constraint Manager.
PADS Analog Analysis Overview
As designs get more complex and development schedules shrink, engineers need to work on prototypes to stay on schedule. Analog designs are no exception.