Accurately identifies yield limiting defects and locates those defects in the physical layout
Performs direct diagnosis (no bypass patterns required) of scan test fails of TestKompress® or FastScan™ patterns
Links directly with Calibre® RVE, the results viewing environment, to view the defect suspects identified by YieldAssist in the physical layout
Enables processing of online volume fail data from manufacturing test
Included in TSMC Reference Flow 6.0 and UMC Reference Flow
Benefit Highlights
Part of comprehensive solution to monitor, maintain and improve device yields
Faster time to profit through improved yield learning and ramp up
Faster, more accurate defect isolation speeds root-cause failure analysis
Processing of volume failure information directly from manufacturing test identifies failure causes, speeds yield learning and eliminate weeks of manual failure analysis effort
