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Industry demands for multi-site test and specialized IO are driving the test interface to use as few pins as possible. Advanced approaches to reduced pin count testing (RPCT) combined with Xpress technology enable high quality test patterns to be applied with both a short test time and minimal test pins.

This TestKompress Xpress presentation covers various design challenges including X's, or unknown states, in test patterns.

Improvements to TestKompress are explained for handling these X's more efficiently so that the user can get even higher levels of test compression than before.

Hear from Janusz Rajski, Ph.D., Mentor Graphics on how industry experts are closing the gap between test, diagnosis and yield learning. This presentation was presented at the Mentor / Verigy seminars.

The presentation focuses on emerging solutions that use logic diagnosis to turn production test results into vehicles for yield learning. High-volume diagnosis is combined with the emerging field of design for manufacturing to enable layout aware analysis. This new approach offers advantages but it also presents many challenges including efficient collection of massive amounts of fail log data in production environment; fast and accurate diagnosis of compressed data; links to process and lithography simulation; statistical post-processing of the results; and calculation of feature failure rates.

Analysis of test data from manufacturing test is a true gold mine of information that can be used to calibrate DFM rules that are largely qualitative and compute yield sensitivity functions. By closing the loop between DFM techniques and the actual defect behavior there is the potential to not only improve yield but also provide validation and calibration of DFM rules.

Hear from Ajay Koche, Ph.D., Verigy, Semiconductor Test Solutions, on how state-of-the-art ATE can deliver cost efficient data collection in volume manufacturing today when taking full advantage of a true test processor per pin architecture. Dr Koche presents how efficient data collection of relevant failure information for high-volume diagnosis also supports the need for lowering cost of test.

The presentation also shows how such an ATE architecture can eventually deliver "zero overhead" data collection for taking full advantage of parallel multi-site testing. Integration with semiconductor manufacturing environments is shown using practical examples and results.

Chief Scientist and Director of Engineering, Janusz Rajski, Ph.D., presents future technology for Mentor's ATPG compression tool, TestKompress Xpress. This next generation of programmable compactor with overdrive is capable of handling a wide range of X-state profiles and provides excellent diagnostic resolution. The two-stage test response compactor uses space and time compression to provide compression ratios higher than the scan chains-to-channels ratio.

Hear from Mentor's Chief Scientist and Directory of Enginnering, Janusz Rajski, Ph.D., on technology now available in TestKompress. This presentation presents a two-stage test response compactor with scan chain selection logic. See how Mentor's solution is capable of handling a wide range of X state profiles, offers compaction much higher than the ratio of scan chains to compactor outputs, and provides excellent diagnostic resolution.

Length: 12 minutes

View this 10 minute product presentation on TestKompress Xpress. This technology can provide test pattern compression factors well above 100x ensuring that companies can meet their challenging quality objectives without driving up the cost of testing. The patented Xpress compactor innovation provides a more efficient way to deal with Xs in designs by combining sophisticated embedded test data selection circuitry with an advanced software control algorithm. Because Xpress technology masks the effects of Xs more efficiently, test pattern sets are more highly compressed. More compressed test patterns result in shorter test times, higher production test throughput, lower manufacturing costs, and can extend the life of existing test equipment.

Length: 15 minutes

In today's nm technology there is a new breed of defect which is systematic in nature, but cannot be identified by the traditional data available for yield analysis. The inability to identify these systematic defects leads to suboptimal yields and the potential for quality and reliability escapes.

This presentation discusses how YieldAssist can provide a new depth of data to empower yield analysis in the nm era and uncover today's hidden systematic defects.

At-Speed transition and path delay scan testing requirements are rapidly increasing to improve the quality of test and to detect the growing population of timing-related defects in 0.13 micron and smaller technologies.

This demo will show you how FastScan is used for at-speed testing and highlights the features of FastScan that enable more efficient and controlled at-speed test.

Approximate length: 10 minutes