DFT Technical Publications

Combining Compression with Fewer Pins Dramatically Saves I/O during Multi-Site Test

Posted in: ATPG & Compression

The manufacturing test process for ICs is increasing in cost and effort to keep up with rigorous quality standards, complexity of newer designs and process nodes, narrower time-to-market windows, and demand to reduce test pins. DFT engineers are using advanced fault models to improve test quality. However, increasing test time and volume, which translates into increased cost, is forcing many companies to apply the necessary tests in fewer test cycles and, if possible, with fewer pins. Reduced pin count testing (RPCT) is a technique to reduce the cost of test by minimizing the pin requirements of a device when tested on an ATE. By applying RPCT, devices can be easily tested on structural DFT testers at a cost of about $200/pin compared to the high-end functional testers that cost almost $8,000-10,000/pin.

By combining RPCT with test compression, we have extended the capabilities of multi-site testing to allow application of at-speed test patterns using low-cost testers that are seriously pin-limited. We were able to free up device I/O by 90%. The method proposed here enables gains in test coverage with less application time and minimal effects on design and test overhead. It can be used in multi-site test, with simpler fixturing.

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The Next Generation of Embedded Test Compression: TestKompress(r) Xpress Compactor

Posted in: ATPG & Compression
The new embedded compression hardware used by TestKompress called Xpress provides significant improvement in compression of test data and test application time for designs with large number of Xs. This paper provides an overview of test quality and cost requirements of nanometer designs as well as the impact of X sources on test quality. A high-level description of the Xpress hardware is followed by benchmark results from industrial designs of Mentor's customer partners.
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TestKompress 2007

Posted in: ATPG & Compression
To help increase product test quality while improving time-to-market and performance, the market leading automated test pattern generation (ATPG) tools have been significantly enhanced for 2007. This paper describes an overview of major enhancements that were made to the ATPG tools FastScan and TestKompress.
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The Robustness of Various Test Compression Techniques

Posted in: ATPG & Compression
Larger designs and the growing population of non-stuck defects have led many companies to adopt test compression techniques. In fact, the Embedded Deterministic Test (EDT) technology within TestKompress has now been used in roughly one billion production chips. There has been a surge of compression techniques promoted in the industry since TestKompress was released in 2003. So, why has TestKompress become the standard approach in industry? This paper will try to explain the technology behind the various compression techniques and their robustness in the presence of Xs, false and multi cycle paths, low pin access, and other design factors.
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Improving Yield - Bridging Fault ATPG in FastScan and TestKompress with Net Pair Identification using Calibre

Posted in: ATPG & Compression
This technical whitepaper discusses the necessary steps for generation of scan patterns that target particular net pairs within a design using the bridging fault model. In order to maximize the value of scan patterns, only net pairs that are likely to bridge because of their physical characteristics are targeted for this fault model. The process of using Calibre tools to identify a list of net pairs targeted for the bridging fault model will be discussed, as well as the steps needed for generating scan patterns to target the suspect net pairs using FastScan™ or TestKompress.
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At-Speed and Advanced Fault Models for Achieving High Quality Test

Posted in: ATPG & Compression
With the increasing clock speeds and the decreasing feature sizes found in today's nanometer designs, at-speed testing is a requirement to achieve high quality test results. In addition, new advanced fault models are also available to improve defect detection and lower DPM rates. Advanced at-speed test capabilities and some new fault models are described in this paper.
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Design Flows Using TestKompress

Posted in: ATPG & Compression

Different embedded compression products and technologies have been tried and discarded as the marketplace selects the solution that best meets all the requirements. Users have determined that a successful embedded compression tool is required to:

  1. Maintain high test quality (i.e. support all fault types)
  2. Achieve high test compression of both test time and test data (up to 100X)
  3. Have little or no impact on the functional design
  4. Add minimal area
  5. Easily fit into the design flow

As evidenced by its widespread industry adoption, TestKompress has met or exceeded all of these requirements while requiring as few as a single scan channel and offering diagnostics directly from compressed patterns. While Design-For-Test (DFT) groups are typically most concerned with high test quality and Operations Test is focused on reducing test time and data, design teams are most concerned with how any tool or methodology will impact the design and how it will fit into their existing design flow. This paper will describe the various design flows that TestKompress supports for the generation, insertion and synthesis of its embedded compression logic. The advantages of each flow are discussed so that the designer can decide which best fits into his or her existing design flow.

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FastScan/TestKompress Diagnostics and Calibre Tool Integration

Posted in: ATPG & Compression

 This application note describes the steps for viewing potential defect sites in the physical environment by directly reading the FastScan/TestKompress diagnostics output into Calibre and highlighting each location in the layout using Calibre DESIGNrev.

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Embedded Deterministic Test - DFT Technology for High-Quality Low-Cost IC Manufacturing Test

Posted in: ATPG & Compression
As the semiconductor technology migrates to 0.13 micron and below, it is becoming increasingly clear that test sets for single stuck-at faults alone are not sufficient to achieve the required quality levels. At 0.13 micron and below, circuits are more susceptible to speed related defects and hence to attain good quality, at-speed test sets such as those based on transition and path delay faults are necessary. While these additional test sets improve the test and product quality, they further exacerbate the problem of rising test data volume and test application time.
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