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Don’t miss IESF Detroit – the annual automotive E/E design forum

John Day

John Day

Posted Apr 25, 2012
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Registration is now open at www.mentor.com/events/iesf/detroit for the 12th IESF Conference for Automotive EE Design – June 14th, 2012 at the Hyatt Regency hotel in Dearborn, MI. Click to sign up if you haven’t already. I missed the last one and don’t want to miss this one – especially since this year I am on the program, speaking about automotive electronics reliability (shameless plug: http://books.sae.org/book-t-126) .

Advance registration is required for the free event, which is sponsored by Mentor Graphics and covers all aspects of electrical and electronic (E/E) design. Presentations and workshops will cover standards such as AUTOSAR, GENIVI, and Linux, among others, as well as technologies including E/E systems design; embedded software; PCB and power and signal design; wire harness engineering; CAN, LIN, and FlexRay networking; system analysis, modeling and simulation, and electronic thermal design and measurement.

The speakers list includes executives from SAE International, the GENIVI Alliance, the Linux Foundation, IBM Rational, Freescale Semiconductor, NXP Semiconductors, Chrysler, Open Kernel Labs, Continental Automotive, Bishop & Associates, Delphi Automotive Systems, Johnson Controls, Mecel, LEONI Wiring Systems; Infolytica, and Mentor Graphics. As in past years Paul Hansen, editor and publisher of The Hansen Report, will assess the current state and likely future of the automotive electronics industry.  There will also be opportunities to meet the experts at lunch and during a post-forum reception.

Every time I attend IESF I come away if not smarter, at least better informed on major trends in automotive E/E engineering. I suspect most other attendees feel the same way. I hope to see you there.

LEONI Wiring Systems, Johnson Controls, system analysis, the GENIVI Alliance, Automotive EE Design, Hyatt Regency Hotel, The Hansen Report, automotive electronics reliability, IBM Rational, the Linux Foundation, wire harness engineering, 'FlexRay, CAN, electronic thermal design and measurement, Chrysler, AUTOSAR, Freescale Semiconductor, Bishop & Associates, GENIVI, Delphi Automotive Systems, Continental Automotive, E/E systems design, SAE International, LIN, power and signal design, NXP Semiconductors, Open Kernel Labs, Mentor Graphics, modeling and simulation, Linux, Mecel

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John DayJohn Day recently launched John Day’s Automotive Electronics News (johndayautomotivelectronics.com) to provide news and feature coverage of the automotive electronics industry. Earlier he wrote for Auto Electronics magazine, Auto E-lectronics, EE Times, and other business and engineering publications. Visit John Day

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