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Lucky 13 – IESF September 19 in Dearborn

John Day

John Day

Posted Aug 15, 2013
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It’s amazing, or not, to think that there have been 12 Integrated Electrical Solutions Forums (IESFs) in Detroit, and now comes the 13th next month at a new location – the Ford Conference Center in Dearborn, Michigan – on Thursday, September 19. To register, visit http://www.mentor.com/iesf.

Event sponsors include IBM and SAE International.

Mentor has added a new track – electric and hybrid vehicle design – and attendees will hear a keynote from Oliver Kuttner, founder and CEO of Edison2, which won the Progressive Insurance Automotive X-Prize in the mainstream class.

I saw some of the X-Prize buildup, and winning that competition, in my opinion, is a really big deal.

Edison2's Very Light Car (VLC)

If you attend you’ll also hear Angus Lyon, chief engineer, Electric Drive Train, Drayson Racing Technologies, which recently set a new World Electric Land Speed Record of 204.185mph, and Adam Fowlkes, electrical engineering manager from Proterra Inc., a leading provider of zero-emission commercial transit solutions.

Other topics among 70 sessions include:

             AUTOSAR – Updates, Challenges and Experiences – Robert Rimkus, engineering group manager for Software Architecture, General Motors

             Vehicle Software and Electrical Management: Process, Methods, Tools and Infrastructure – The Ford Experience – Christopher Davey, senior technical leader, Software and Control Systems Engineering, Ford Motor Company

             Connected and Electrified Vehicle – New Role for Standards – Jack Pokrzywa, director, Ground Vehicle Standards, SAE International

             Integrating a New ECAD System with Service Publications – Arnold Taube, principal engineer, Deere & Company

             Bringing Best-in-Industry Capability to our Engineers to Free Them to Innovate – Aaron Shin, senior director of Transition to Production, Raytheon

             Importance of Systems Engineering for Aston Martin – Alan Bennett, chief engineer, Electrical and Electronics, Aston Martin

             Systems Engineering at the Platform Level – Martin O’Brien, general manager, Integrated Electrical Systems, Mentor Graphics

             Strategic Reuse – A Fundamental Approach for Success in E/E Engineering – Dr. Ron Felice, solution architect for Real Time and Embedded Systems, IBM

             Delivering Multi-domain Automotive Electronic Systems with GENIVI, AUTOSAR, and Hypervisor Technology  – Warren Kurisu, director of product management, Embedded Software Division, Mentor Graphics

             Is that Your Customer? IBM’s Latest Findings from Automotive Executives and 4,000 other C-suite Level Executives – Karen Newman, vice president, Americans Automotive Industry, IBM

And putting the automotive electronics industry into perspective, Paul Hansen, The Hansen Report

GENIVI, General Motors, IBM, Automotive X-Prize, SAE International, The Hansen Report, AUTOSAR, Aston Martin, IESF, Edison2, Mentor Graphics, Ford Motor Company, Progressive Insurance, Drayson Racing Technologies, Proterra, ECAD

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John DayJohn Day recently launched John Day’s Automotive Electronics News (johndayautomotivelectronics.com) to provide news and feature coverage of the automotive electronics industry. Earlier he wrote for Auto Electronics magazine, Auto E-lectronics, EE Times, and other business and engineering publications. Visit John Day

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