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Lucky 13 – IESF September 19 in Dearborn

John Day

John Day

Posted Aug 15, 2013

It’s amazing, or not, to think that there have been 12 Integrated Electrical Solutions Forums (IESFs) in Detroit, and now comes the 13th next month at a new location – the Ford Conference Center in Dearborn, Michigan – on Thursday, September 19. To register, visit

Event sponsors include IBM and SAE International.

Mentor has added a new track – electric and hybrid vehicle design – and attendees will hear a keynote from Oliver Kuttner, founder and CEO of Edison2, which won the Progressive Insurance Automotive X-Prize in the mainstream class.

I saw some of the X-Prize buildup, and winning that competition, in my opinion, is a really big deal.

Edison2's Very Light Car (VLC)

If you attend you’ll also hear Angus Lyon, chief engineer, Electric Drive Train, Drayson Racing Technologies, which recently set a new World Electric Land Speed Record of 204.185mph, and Adam Fowlkes, electrical engineering manager from Proterra Inc., a leading provider of zero-emission commercial transit solutions.

Other topics among 70 sessions include:

             AUTOSAR – Updates, Challenges and Experiences – Robert Rimkus, engineering group manager for Software Architecture, General Motors

             Vehicle Software and Electrical Management: Process, Methods, Tools and Infrastructure – The Ford Experience – Christopher Davey, senior technical leader, Software and Control Systems Engineering, Ford Motor Company

             Connected and Electrified Vehicle – New Role for Standards – Jack Pokrzywa, director, Ground Vehicle Standards, SAE International

             Integrating a New ECAD System with Service Publications – Arnold Taube, principal engineer, Deere & Company

             Bringing Best-in-Industry Capability to our Engineers to Free Them to Innovate – Aaron Shin, senior director of Transition to Production, Raytheon

             Importance of Systems Engineering for Aston Martin – Alan Bennett, chief engineer, Electrical and Electronics, Aston Martin

             Systems Engineering at the Platform Level – Martin O’Brien, general manager, Integrated Electrical Systems, Mentor Graphics

             Strategic Reuse – A Fundamental Approach for Success in E/E Engineering – Dr. Ron Felice, solution architect for Real Time and Embedded Systems, IBM

             Delivering Multi-domain Automotive Electronic Systems with GENIVI, AUTOSAR, and Hypervisor Technology  – Warren Kurisu, director of product management, Embedded Software Division, Mentor Graphics

             Is that Your Customer? IBM’s Latest Findings from Automotive Executives and 4,000 other C-suite Level Executives – Karen Newman, vice president, Americans Automotive Industry, IBM

And putting the automotive electronics industry into perspective, Paul Hansen, The Hansen Report

GENIVI, General Motors, IBM, Automotive X-Prize, SAE International, The Hansen Report, Aston Martin, IESF, Edison2, Mentor Graphics, Ford Motor Company, Progressive Insurance, Drayson Racing Technologies, Proterra, ECAD

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John DayJohn Day recently launched John Day’s Automotive Electronics News ( to provide news and feature coverage of the automotive electronics industry. Earlier he wrote for Auto Electronics magazine, Auto E-lectronics, EE Times, and other business and engineering publications. Visit John Day

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