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Featured Multimedia
Meeting the Challenge of Developing the 'More Electric' Aircraft
43:12Technology Overview: As electronic content increases dramatically in aerospace design, aircraft are evolving into sophisticated networked computing platforms. Unfortunately, there has not been a corresponding evolution in electronic... 43:12
Tags: Aerospace, Capital®, General Session, IESF, Mil-Aero, Military
Connected Technology for Manufacturing Engineering
29:40Technology Overview: Manufacturing engineers apply their skills and knowledge to huge volumes of data to accomplish complex tasks. This session shows how Capital’s capability extends into manufacturing process planning... 29:40
Tags: Aerospace, Capital FormboardXC, Capital Harness MPM, Capital Harness TVM, Capital HarnessXC, Capital ModularXC, Capital®, General Session, IESF, Mil-Aero, Military
Strong Aircraft, Weak Economy: A Complicated Picture
49:54Technology Overview: A discussion of all major market trends in the aviation business today, the presentation will cover growth rates, market risks, and competitive dynamics for all turbine-powered aircraft markets, products,... 49:54
Tags: Aerospace, Capital®, General Session, IESF, Mil-Aero, Military
AOG: Reducing Aircraft-on-Ground Time via Smart Documentation
34:37On-demand Web Seminar: Create service documentation to cut the time, deliver custom documentation for each aircraft and assist to diagnose and fix faults. 34:37
Tags: Aerospace, Capital®, Service
IESF China: Opportunities and Challenges in the China Automotive Market
41:11Technology Overview: Keynote from IESF - Shanghai, China: Opportunities and Challenges in China's Automotive Market presented by: Wally C. Rhines, Chairman and CEO, Mentor Graphics. 41:11
Tags: Automotive, Capital®, General Session, IESF
The Current Health and Future of the Automotive Interconnect Industry
25:10Technology Overview: Bishop & Associates is the leading market research firm exclusively serving the interconnect industry for the last 25 years. In this presentation, Pheteplace will review the economic, environment, and... 25:10
Tags: Automotive, Capital®, Electrical System Design, IESF
The Auto Sun is Rising - The Future of Technology in the Automotive Industry
26:33Technology Overview: The Auto Sun is Rising - The Future of Technology in the Automotive Industry 26:33
Tags: Automotive, Capital®, General Session, IESF
Maintaining Competitive Advantage by Applying IP
37:43Technology Overview: In a competitive and dynamic environment it is important for companies to capture and apply the intellectual property (IP) that helps create their market position. This Breakout examines strategies for... 37:43
Tags: Automotive, Capital®, Electrical System Design, IESF
Managing the Complexity of Automotive EE Design the STANDARDS Way! From AUTOSAR to GENIVI, ISO to SAE - Challenges, Trends and Observations
34:50Technology Overview: Recent advances in electronics enable vehicle OEMs to offer a wide variety of services and conveniences that customers not only appreciate but expect, such as electronic fuel injection and popular GPS,... 34:50
Tags: Automotive, Capital®, General Session, IESF
The Challenges of Virtual Analysis Tool Adoption in the Automotive Industry
31:33Technology Overview: This presentation is a keynote session from IESF 2012: "The Challenges of Virtual Analysis Tool Adoption in the Automotive Industry". It is presented by Dr. Mircea Gradu, Vice President,... 31:33
Tags: Automotive, Capital®, General Session, IESF
Industry Update - Electrical and Electronics 2012 Industry Trends and Observations
29:05Technology Overview: Paul Hansen, in his 5th appearance at IESF, will give his insights on the global automotive electronics industry. Hansen writes and publishes The Hansen Report on automotive electronics, a newsletter dedicated... 29:05
Tags: Automotive, Capital®, General Session, IESF
Strategic Reuse - A Fundamental Approach for Success in EE Engineering
29:14Technology Overview: We all understand reuse is key to increasing efficiencies; we have found it difficult to realize in automotive embedded systems. Through standardization and open source efforts such as Genivi, OSEK and... 29:14
Tags: Automotive, Capital®, General Session, IESF