Delivering 10X Design Improvements
Time and time again, escalating complexity has threatened to derail the IC industry from the extraordinary 35% annual reduction in transistor pricing it has enjoyed the past 40+ years. Fortunately, in each and every instance, creative engineers and companies have seen this as a challenge and opportunity to innovate. As a result, the electronic design automation industry has repeatedly delivered order of magnitude improvements in every aspect of the IC design cycle for over three decades.
Today, the exponential rise in complexity has quickened its pace as the industry moves toward adoption of 28 nm and below. Dr. Wally Rhines will discuss how in the next five years, 10X improvements in design methodologies are needed in four principal areas: high-level system design, verification, embedded software development, and back-end physical design and test. He will provide a roadmap for the next wave of changes needed to successfully negotiate rising complexity, highlighting where they will most likely occur.
On-demand Web Seminar: This event will describe several methodologies that enable designers to reduce the number of pins and top level routing required for the application of high quality test. The focus will be on manufacturing...…View On-demand Web Seminar
On-demand Web Seminar: During this presentation we discuss the trends, drivers and solutions for power-aware test that have emerged. We will take a look at the technologies where power-aware test required, how designers are looking...…View On-demand Web Seminar
On-demand Web Seminar: This presentation covers key aspects to the forces from a technology and market perspective that are driving designers towards better energy efficient designs.…View On-demand Web Seminar
White Paper: The manufacturing test process for ICs is increasing in cost and effort to keep up with rigorous quality standards, complexity of newer designs and process nodes, narrower time-to-market windows, and demand...…View White Paper
White Paper: Many large systems-on-chip (SOC) designs today incorporate several third-party IP cores that cover a wide range of functionality. These cores often consist of high-performance embedded processors such as...…View White Paper