With each new process technology node, chip designs increase in complexity and size, leading to a steady increase in data volumes. As a result, mask data prep flows require more computing resources to maintain the desired turn-around time (TAT) at a low cost. The effect is aggravated by the fact that a mask house operates a variety of equipment for mask writing, inspection and metrology – all of which, until now, require specific data formatting. An industry initiative sponsored by SEMI® has established new public formats – OASIS® (P39) for general layouts and OASIS.MASK (P44) for mask manufacturing equipment – that allow for the smallest possible representation of data for various applications. This paper will review a mask data preparation process for mask inspection based on the OASIS formats that also reads OASIS.MASK files directly in real time into the inspection tool. An implementation based on standard parallelized computer hardware will be described and characterized as demonstrating throughputs required for the 45nm and 32nm technology nodes. An inspection test case will also be reviewed.