David Abercrombie recently met with Brian Bailey of Semiconductor Engineering to explain many of the concepts and issues of multi-patterning that he has been writing about for the last couple of years. If you want to understand the basics of multi-patterning requirements, 12 minutes is all you need to check out their first video: Tech Talk: Multipatterning on semiengineering.com. If the video piques … Read More
IC Design Blog
The terms vector and vectorless modes are commonly used in the context of dynamic power grid (PG) analysis, but what do these terms mean? The PG dynamic simulator uses a design’s activity suite to compute the voltages and currents in the PG network. In vector mode, typically referred as a value change dump (VCD), logic simulation is used to generate the complete activity suite. In vectorless mode, the … Read More
Are you a TSMC customer or partner? If so, you’ll want to take a look at our presentations from the 2013 TSMC Open Innovation Platform conference. Design Reliability with Calibre YieldEnhancer/SmartFill and Calibre PERC Broadcom & Mentor Graphics The complexity of advanced technologies drives new requirements for poly/OD and metal fill to solve critical manufacturing effects, and more importantly … Read More
At advanced nodes, variability issues lurk behind every design mode, power state, process condition, and manufacturing step. Yet designers must find a way to balance the optimization of multiple operational modes and design corners against the aggressive performance and power targets demanded by today’s fast-moving markets. Concurrent analysis and optimization during place and route operations can provide … Read More
Download the latest version of our guide to multi-patterning design and debugging, containing links to all of David Abercrombie’s detailed educational articles on SemiEngineering.com, along with links for complementary reference and learning options. Whether you are already working on designs with multi-patterning requirements, or just beginning multi-patterning work, you will benefit from David’s … Read More
Diamonds may not be a designer’s best friend when debugging triple patterning errors. Triple patterning violations can be quite complex, and debugging can be tricky, but the challenges are manageable with software that helps the designer understand the design issues. Learn how to recognize and avoid triple patterning traps in part 2 of The Trouble with Triples on SemiEngineering by multi-patterning … Read More
Are you a TSMC customer or partner? If so, you’ll want to take a look at these presentations from the 2013 TSMC Open Innovation Platform conference. Design Reliability with Calibre YE-SmartFill and Calibre PERC (Broadcom & Mentor Graphics) New methodologies were developed for 28nm designs using Calibre SmartFill and Calibre PERC. Calibre SmartFill was deployed to meet the new strict DFM requirements … Read More
All the major foundries have announced FinFET technologies. FinFETs hold the promise of lower power usage and better area utilization, as well as traditional scaling improvements. Aaaaand…the thought of implementing them may be scaring the willies out of a lot of designers. How do I design these things? How do I know what the design needs? How do I verify them? Well, first, take a deep breath. … Read More
What’s coming in 2014? What new challenges await? Are you ready? Get a heads-up on some of the trends and events of the next 12 months with two articles. First, if you’re contemplating, or already working on, 2.5D and 3D ICs, you should take a look at 3D IC Design: Outlook for 2014 on 3D InCites. Written by Joseph Sawicki, this article can help you prepare for your 3D IC implementations. … Read More
DRC- and DFM-clean designs can still have hundreds to thousands of violations that must be debugged and corrected. How? Why? Mismatches between a router’s simplified tech file and the complete (and complex) signoff design rule decks at advanced nodes are generating significant numbers of DRC/DFM errors that can wreak havoc on your tapeout schedules. In particular, we’re seeing greater visibility … Read More
It happens all the time, to all of us. You need a quick answer for a very specific question about using your EDA tools. You don’t want to wade through technical documentation, you don’t have time for an email response, and you really don’t want to try searching EDA forums for an answer. We feel your pain, and we decided to do something about it. Need to know how to extract a net from … Read More
Press releases can make it seem like EDA tool qualification for a particular IC process node is the “end game.” But in truth, qualification is just the first publicly visible step of ongoing collaborations between an EDA vendor and the foundry. Michael White takes you behind the curtain for a peek at what goes on during qualification from start to finish, as part of his ongoing Silicon Edge series … Read More
Just like blueprints give an architect a visual representation of a building, design patterns provide engineers with a visual depiction of complex layout geometries. Design patterns have become a useful tool throughout design, verification, and test processes. This Design-to-Silicon white paper explains how Calibre Pattern Matching software can help you implement automated pattern capture and pattern … Read More
While processes like double and triple patterning may sometimes seem like magic, successfully implementing multi-patterning compliance in the IC design and verification flow requires a thorough understanding of multi-patterning techniques and their impact on your design. In this white paper from David Abercrombie, learn what multi-patterning is, why you need it, and how Calibre Multi-Patterning software … Read More
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Triple patterning is not just double patterning with an extra color! Our resident expert, David Abercrombie, introduces the basics of triple patterning and explains the new challenges it brings to the layout and verification flow in his ongoing series for for SemiconductorEngineering’s Manufacturing and Design segment. If you’re even thinking about advanced node designs, this is a must-read. Bonus references … Read More
- Lights! Camera! Multi-Patterning!
- Vector? Vectorless? What’s a power grid to do?
- Mentor's TSMC OIP Presentations Now Available!
- Variability is EVERYWHERE!
- UPDATE: Multi-Patterning Unmasked!!
- The Trouble with Triples—Part 2
- TSMC OIP presentations now available!
- FinFET Fever...or FinFET Fear?
- 2014 is Underway! What's on Your Calendar?
- Routing Closure Challenges at 28nm and Below
- March, 2014
- February, 2014
- January, 2014
- December, 2013
- Qualification Is Just the Beginning
- Pattern Matching: Blueprints for Further Success
- Mastering the Magic of Multi-Patterning
- The Trouble With Triples—Part 1
- Reducing the Tapeout Crunch with Signoff Confidence
- Foundry Solutions Video Blog: Calibre PERC
- Customizing Calibre Jobs without Editing Rule Decks
- Model-Based Hints: GPS for LFD Success
- October, 2013
- September, 2013
- July, 2013
- April, 2013
- March, 2013
- December, 2012
- March, 2012
- May, 2011
- April, 2011
- February, 2011
- January, 2011
- November, 2010
- August, 2010
- June, 2010
- May, 2010
- April, 2010
- March, 2010
- February, 2010
- January, 2010
- December, 2009
- November, 2009
- October, 2009
- September, 2009
- August, 2009
- July, 2009
- June, 2009
- "Waive" of the Future?
- How do you debug LVS?
- DFM for Non-PhD's: Part 2 - Reliability
- Mixed-Signal SoC Verification
- Process Variation: The Use of In-Die Variation
- DFM for Non-PhDs
- Calibre Everywhere -- the customer value of universal integration
- So, why not just write better rules?
- To be the man, you've gotta beat the man!
- Power in need, Power indeed
- May, 2009