Several high-growth IC markets are experiencing demand for higher reliability, including mobile/wireless, automotive, industrial control, and medical. At the same time, factors such as thinner gate oxide and multiple power rails have the potential to introduce new failure mechanisms. This panel discusses the demand for IC reliability, what design methodologies can reduce the occurrence of delayed failure mechanisms, and how design for reliability checks can be automated to help remove the burden from designers.
- Matt Hogan, Product Marketing Manager, Calibre Design Solutions, Mentor Graphics
- Ofer Tamir, Director of Design Enablement and Design Support, TowerJazz
- Ertugrul Demircan, PVG Manager, Freescale
- Tim Turner, Reliability Center Business Development Manager, College of Nanoscale Science and Engineering