The IC industry will undergo significant changes as future growth is driven not just by traditional Moore’s Law scaling, but also by “More Than Moore” technologies, including 3D-IC, MEMS, and silicon photonics. This panel discusses the exciting opportunities and challenges ahead.
- John Ferguson, Director of Marketing, Calibre DRC Applications, Mentor Graphics
- Michael Hochberg, Director, OpSIS, University of Delaware
- Robert Patti, CTO and VP of Design Engineering, Tezzaron
- Suk Lee, Senior Director, Design Infrastructure Marketing Division, TSMC