What’s coming in 2014? What new challenges await? Are you ready? Get a heads-up on some of the trends and events of the next 12 months with two articles. First, if you’re contemplating, or already working on, 2.5D and 3D ICs, you should take a look at 3D IC Design: Outlook for 2014 on 3D InCites. Written by Joseph Sawicki, this article can help you prepare for your 3D IC implementations. … Read More
IC Design Blog
Posts tagged with 'Design Rule Checking'
DRC- and DFM-clean designs can still have hundreds to thousands of violations that must be debugged and corrected. How? Why? Mismatches between a router’s simplified tech file and the complete (and complex) signoff design rule decks at advanced nodes are generating significant numbers of DRC/DFM errors that can wreak havoc on your tapeout schedules. In particular, we’re seeing greater visibility … Read More
Just like blueprints give an architect a visual representation of a building, design patterns provide engineers with a visual depiction of complex layout geometries. Design patterns have become a useful tool throughout design, verification, and test processes. This Design-to-Silicon white paper explains how Calibre Pattern Matching software can help you implement automated pattern capture and pattern … Read More
Jean-Marie Brunet examines the reasons why the “tapeout crunch” is getting worse and worse at advanced nodes, and suggests some possible solutions, in this forward-looking article written for SemiconductorEngineering.com. … Read More
I got some questions from my last installment of this series asking for some pictures of defects that caused yield issues in production that could have been avoided during design. It struck me that most designers probably never get a chance to see the manufacturing problems their designs encounter. Since my background is in the fab, I wrongly assumed everyone had lived through the same pain as myself. … Read More
I felt privileged this year to get a paper accepted into the technical track at DAC. It seems more and more difficult to get something through. I think they said they only had a 20% acceptance rate this year. I was glad to get to present this one because it was fun doing the experimentation for it and I think it helps answer one of the nagging questions I always get about eqDRC. I worked with Fedor … Read More
Well, day two of DAC started a little earlier than the first day. I had to attend the speakers breakfast for the paper I was going to give later that day. However, after breakfast I had my 9am suite presentation on eqDRC again and I also had a special guest again. This time it was Robert Boone from Freescale in Austin, TX. He works in the DFM team and he also agreed to come tell everyone what he and … Read More
Well it felt familiar to be back in San Francisco for DAC this year. However, I wasn’t ready for the cold. It was 100 degrees in Portland when I left and I always assume the Bay area will be warmer. Luckily I looked at the weather map before I finished packing and replaced my short sleeve shirts with long sleeve ones. I didn’t get in until late Sunday night so I only had time for a dinner in the Westin … Read More
That is the question! If you read my colleague John’s most recent posting “Waive of the future?”, you will understand the question. I was equally shocked as John to find that almost no one tapes out DRC clean anymore. I would add one other reason to John’s list as to why this has happened. I think the traditional DRC rules are broken. Please read my first post “Are Design Rules Broken?” for my stance … Read More
It is no mystery that the number of design rules has exploded over the past few technology nodes. It’s impossible for any human designer to “remember” them all, much less follow them all. It’s also a problem for the CAD engineer. We extracted some data from a spectrum of DRC decks that our customers have in production and the graph below shows the results. DRC Rule Count and Complexity by Technology … Read More
- Lights! Camera! Multi-Patterning!
- Vector? Vectorless? What’s a power grid to do?
- Mentor's TSMC OIP Presentations Now Available!
- Variability is EVERYWHERE!
- UPDATE: Multi-Patterning Unmasked!!
- The Trouble with Triples—Part 2
- TSMC OIP presentations now available!
- FinFET Fever...or FinFET Fear?
- 2014 is Underway! What's on Your Calendar?
- Routing Closure Challenges at 28nm and Below
- March, 2014
- February, 2014
- January, 2014
- December, 2013
- Qualification Is Just the Beginning
- Pattern Matching: Blueprints for Further Success
- Mastering the Magic of Multi-Patterning
- The Trouble With Triples—Part 1
- Reducing the Tapeout Crunch with Signoff Confidence
- Foundry Solutions Video Blog: Calibre PERC
- Customizing Calibre Jobs without Editing Rule Decks
- Model-Based Hints: GPS for LFD Success
- October, 2013
- September, 2013
- July, 2013
- April, 2013
- March, 2013
- December, 2012
- March, 2012
- May, 2011
- April, 2011
- February, 2011
- January, 2011
- November, 2010
- August, 2010
- June, 2010
- May, 2010
- April, 2010
- March, 2010
- February, 2010
- January, 2010
- December, 2009
- November, 2009
- October, 2009
- September, 2009
- August, 2009
- July, 2009
- June, 2009
- "Waive" of the Future?
- How do you debug LVS?
- DFM for Non-PhD's: Part 2 - Reliability
- Mixed-Signal SoC Verification
- Process Variation: The Use of In-Die Variation
- DFM for Non-PhDs
- Calibre Everywhere -- the customer value of universal integration
- So, why not just write better rules?
- To be the man, you've gotta beat the man!
- Power in need, Power indeed
- May, 2009