All the major foundries have announced FinFET technologies. FinFETs hold the promise of lower power usage and better area utilization, as well as traditional scaling improvements. Aaaaand…the thought of implementing them may be scaring the willies out of a lot of designers. How do I design these things? How do I know what the design needs? How do I verify them? Well, first, take a deep breath. … Read More
IC Design Blog
Posts tagged with 'Foundry'
What’s coming in 2014? What new challenges await? Are you ready? Get a heads-up on some of the trends and events of the next 12 months with two articles. First, if you’re contemplating, or already working on, 2.5D and 3D ICs, you should take a look at 3D IC Design: Outlook for 2014 on 3D InCites. Written by Joseph Sawicki, this article can help you prepare for your 3D IC implementations. … Read More
Press releases can make it seem like EDA tool qualification for a particular IC process node is the “end game.” But in truth, qualification is just the first publicly visible step of ongoing collaborations between an EDA vendor and the foundry. Michael White takes you behind the curtain for a peek at what goes on during qualification from start to finish, as part of his ongoing Silicon Edge series … Read More
Just like blueprints give an architect a visual representation of a building, design patterns provide engineers with a visual depiction of complex layout geometries. Design patterns have become a useful tool throughout design, verification, and test processes. This Design-to-Silicon white paper explains how Calibre Pattern Matching software can help you implement automated pattern capture and pattern … Read More
While processes like double and triple patterning may sometimes seem like magic, successfully implementing multi-patterning compliance in the IC design and verification flow requires a thorough understanding of multi-patterning techniques and their impact on your design. In this white paper from David Abercrombie, learn what multi-patterning is, why you need it, and how Calibre Multi-Patterning software … Read More
odd cycle, multipatterning, 16nm, Lithography, 20nm, mandrel, Mentor Graphics, Multi-Patterning, 14nm, colorless design, layout decomposition, D2S, LELE, anchor path, litho, Calibre Multi-Patterning, litho-etch-litho-etch, FinFET, double patterning, Foundry, warning rings, Parasitic Extraction, spacer-assisted, triple patterning, spacer is dielectric, spacer is mask, SID SADP, SIM SADP, pin coloring, pitch-split
Triple patterning is not just double patterning with an extra color! Our resident expert, David Abercrombie, introduces the basics of triple patterning and explains the new challenges it brings to the layout and verification flow in his ongoing series for for SemiconductorEngineering’s Manufacturing and Design segment. If you’re even thinking about advanced node designs, this is a must-read. Bonus references … Read More
Jean-Marie Brunet examines the reasons why the “tapeout crunch” is getting worse and worse at advanced nodes, and suggests some possible solutions, in this forward-looking article written for SemiconductorEngineering.com. … Read More
No one wants to edit a foundry rule deck—it’s like tugging on Superman’s cape. But there are many ways to customize the input to a Calibre job without modifying the foundry rule deck. To learn more, watch one of our short, to-the-point How-To videos on our IC Nanometer Design channel on YouTube. Oh, and if you can’t find what you’re looking for? Suggest a new topic! … Read More
Optical lithography is not dead yet! 193nm immersion lithography will be used for the 20/22nm node, and with the continued delay of EUV, is now the plan of record for 14nm. Gandharv Bhatara explains how new OPC technology solves both the CD and turn-around time at very the edges of advanced node manufacturability. Read More … Read More
In both my last post, and in John Ferguson’s posts, the reasons, challenges and costs associated with “waivers” for DRC were discussed. As we have both pointed out, this is a growing problem as the IC industry increases its use of 3rd party IP while simultaneously the number of waivers within that IP is also increasing – resulting in a sea of waivers to deal with. As we have deployed our Calibre … Read More
Historically, design rule checking (DRC) was a black or white proposition—either you passed all your DRC’s or you fixed the errors until you did pass. Fast forward to today where much/most of the IP you use is from 3rd parties and/or your product has an increasing percentage of memory content and your design is never DRC clean at tape out. Your design team is now constantly waiving over and over and … Read More
Since DAC we have heard a lot about physical verification tools claiming they can read the Calibre(R) SVRF/TVF syntax natively. This blog explores why competitive EDA companies are trying to use Calibre SVRF/TVF, the challenges involved, and the risks to customers. Why Do Competing PV Products Want to Use Calibre SVRF? Calibre is a primary sign-off standard at all the major foundries and IDMs, and … Read More
- Lights! Camera! Multi-Patterning!
- Vector? Vectorless? What’s a power grid to do?
- Mentor's TSMC OIP Presentations Now Available!
- Variability is EVERYWHERE!
- UPDATE: Multi-Patterning Unmasked!!
- The Trouble with Triples—Part 2
- TSMC OIP presentations now available!
- FinFET Fever...or FinFET Fear?
- 2014 is Underway! What's on Your Calendar?
- Routing Closure Challenges at 28nm and Below
- March, 2014
- February, 2014
- January, 2014
- December, 2013
- Qualification Is Just the Beginning
- Pattern Matching: Blueprints for Further Success
- Mastering the Magic of Multi-Patterning
- The Trouble With Triples—Part 1
- Reducing the Tapeout Crunch with Signoff Confidence
- Foundry Solutions Video Blog: Calibre PERC
- Customizing Calibre Jobs without Editing Rule Decks
- Model-Based Hints: GPS for LFD Success
- October, 2013
- September, 2013
- July, 2013
- April, 2013
- March, 2013
- December, 2012
- March, 2012
- May, 2011
- April, 2011
- February, 2011
- January, 2011
- November, 2010
- August, 2010
- June, 2010
- May, 2010
- April, 2010
- March, 2010
- February, 2010
- January, 2010
- December, 2009
- November, 2009
- October, 2009
- September, 2009
- August, 2009
- July, 2009
- June, 2009
- "Waive" of the Future?
- How do you debug LVS?
- DFM for Non-PhD's: Part 2 - Reliability
- Mixed-Signal SoC Verification
- Process Variation: The Use of In-Die Variation
- DFM for Non-PhDs
- Calibre Everywhere -- the customer value of universal integration
- So, why not just write better rules?
- To be the man, you've gotta beat the man!
- Power in need, Power indeed
- May, 2009