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IC Design Blog

Posts tagged with 'IC Design'

21 Mar, 2014

I See the Light!

Posted by Shelly Stalnaker

Shelly Stalnaker Photonics technology isn’t new, by any means, but what is new is the drive to leverage high-volume silicon-based semiconductor manufacturing foundries and processes to build chips that can create, sense, modulate, and transmit light. So says Michael White in his latest SiliconEdge column on Electronic Design. The biggest challenge in applying CMOS foundry processes to silicon photonics is creating … Read More

Foundry, IC Design, silicon photonics, waveguides, ic manufacturing, Michael White

19 Mar, 2014

Déjà Vu All Over Again

Posted by Shelly Stalnaker

Shelly Stalnaker Trailblazers, followers, and stragglers…semiconductor companies have usually always sorted themselves out along these lines. At 20nm, though ,we’re beginning to see a shift in these classifications that is affecting both technology node adoption and market strategy. Only a few companies are moving to nodes at 20nm and below, while many of the typical followers have decided to stay at 28nm … Read More

Foundry, IC Design, 14nm, 16nm, 10nm, advanced node, leading-edge, Semiconductor, Christen Decoin, 20nm, technology node, 28nm

18 Mar, 2014

Old Faithful

Posted by Shelly Stalnaker

Shelly Stalnaker While unpredictability may account for the lure of gambling, reliability is an essential part of our everyday lives. Yellowstone National Park, which sits above the Yellowstone Caldera, contains half of the world’s geothermal features. Among the most famous is Old Faithful, a huge geyser that erupts at regular intervals. One reason tourists flock from all over the world to this park is that they know … Read More

IC Design, Foundry Solutions, IC Verification, 16nm, 20nm, 10nm, circuit, PERC, Reliability, electrical, 45nm, Verification, Calibre

14 Mar, 2014

Are You ECO-Friendly?

Posted by Shelly Stalnaker

Shelly Stalnaker Every designer dreads the last-minute engineering change order, or ECO. Just when you think you’re done…you’re not. At 45nm and below, ECOs get even more difficult to implement, because fill now has a direct impact on design performance. A small re-routing can get complicated very quickly with the complex fill requirements of advanced nodes. Fortunately, help is available! On Semiconductor … Read More

P&R, Jeff Wilson, place and route, 45nm, 20nm, IC Design, smart fill, ic manufacturing, DRC, ECO fill

3 Mar, 2014

Lights! Camera! Multi-Patterning!

Posted by Shelly Stalnaker

Shelly Stalnaker David Abercrombie recently met with Brian Bailey of Semiconductor Engineering to explain many of the concepts and issues of multi-patterning that he has been writing about for the last couple of years. If you want to understand the basics of multi-patterning requirements, 12 minutes is all you need to check out their first video: Tech Talk: Multipatterning on semiengineering.com. If the video piques … Read More

double patterning, EUV, 20nm, Multi-Patterning, triple patterning, IC Design, ic manufacturing

19 Feb, 2014

Shelly Stalnaker The terms vector and vectorless modes are commonly used in the context of dynamic power grid (PG) analysis, but what do these terms mean? The PG dynamic simulator uses a design’s activity suite to compute the voltages and currents in the PG network. In vector mode, typically referred as a value change dump (VCD), logic simulation is used to generate the complete activity suite. In vectorless mode, the … Read More

IC Design, IC Verification, dynamic power grid analysis, vcd, vectorless verification, power grid analysis, value change dump

14 Feb, 2014

Variability is EVERYWHERE!

Posted by Shelly Stalnaker

Shelly Stalnaker At advanced nodes, variability issues lurk behind every design mode, power state, process condition, and manufacturing step. Yet designers must find a way to balance the optimization of multiple operational modes and design corners against the aggressive performance and power targets demanded by today’s fast-moving markets. Concurrent analysis and optimization during place and route operations can provide … Read More

place and route, design corners, IC Design, concurrent analysis, Olympus-SoC, P&R, IC Verification, mcmm

29 Jan, 2014

UPDATE: Multi-Patterning Unmasked!!

Posted by Shelly Stalnaker

Shelly Stalnaker Download the latest version of our guide to multi-patterning design and debugging, containing links to all of David Abercrombie’s detailed educational articles on SemiEngineering.com, along with links for complementary reference and learning options. Whether you are already working on designs with multi-patterning requirements, or just beginning multi-patterning work, you will benefit from David’s … Read More

triple patterning, double patterning, IC Design, Debugging, Physical Verification, SADP, ic manufacturing, Multi-Patterning

15 Jan, 2014

2014 is Underway! What's on Your Calendar?

Posted by Shelly Stalnaker

Shelly Stalnaker What’s coming in 2014? What new challenges await? Are you ready? Get a heads-up on some of the trends and events of the next 12 months with two articles. First, if you’re contemplating, or already working on, 2.5D and 3D ICs, you should take a look at 3D IC Design: Outlook for 2014 on 3D InCites. Written by Joseph Sawicki, this article can help you prepare for your 3D IC implementations. … Read More

Design for Manufacturing, Calibre, Design Rule Checking, 14nm, IC Design, 16nm, IC Verification, MEMs, 10nm, Physical Verification, 3D-IC, DRC, 3DIC, FinFET, 2.5D, Foundry, 20nm

15 Jan, 2014

Shelly Stalnaker DRC- and DFM-clean designs can still have hundreds to thousands of violations that must be debugged and corrected. How? Why? Mismatches between a router’s simplified tech file and the complete (and complex) signoff design rule decks at advanced nodes are generating significant numbers of DRC/DFM errors that can wreak havoc on your tapeout schedules. In particular, we’re seeing greater visibility … Read More

tech file, tapeout, DRC, Design Rule Checking, P&R, signoff, IC Design, IC Verification

30 Mar, 2010

Michael White In both my last post, and in John Ferguson’s posts, the reasons, challenges and costs associated with “waivers” for DRC were discussed.  As we have both pointed out, this is a growing problem as the IC industry increases its use of 3rd party IP while simultaneously the number of waivers within that IP is also increasing – resulting in a sea of waivers to deal with.  As we have deployed our Calibre … Read More

Waiver, Fab-lite, Fabless, Calibre, IC Design, Physical Verification, Foundries, Foundry

28 Jan, 2010

Michael White Design rule checking (DRC) or physical verification used to be easy.  For example, run some 1-D width and spacing checks to ensure things will resolve and won’t short and you are good to go.  These checks were simple to write, fast to run and understandable, and quick to debug.  Today is a new world order, where none of these attributes are true anymore.  An increasing number of checks are 2-D, very … Read More

IDM, IC Design, Pattern Matching, SoC, eqDRC, Calibre, Physical Verification, Fabless, Productivity, Foundries, Equation-Based DRC, PV, Sign-off, Fab-lite

15 Jan, 2010

Michael White Historically, design rule checking (DRC) was a black or white proposition—either you passed all your DRC’s or you fixed the errors until you did pass.  Fast forward to today where much/most of the IP you use is from 3rd parties and/or your product has an increasing percentage of memory content and your design is never DRC clean at tape out.  Your design team is now constantly waiving over and over and … Read More

Foundry, Foundries, IC Design, DRC, SVRF, Tax, Waiver, Calibre, Physical Verification, Fab-lite, Productivity, Fabless, Sign-off, eqDRC, SoC, Equation-Based DRC

17 Dec, 2009

Does SVRF Direct Read Make Sense?

Posted by Michael White

Michael White Since DAC we have heard a lot about physical verification tools claiming they can read the Calibre(R) SVRF/TVF syntax natively. This blog explores why competitive EDA companies are trying to use Calibre SVRF/TVF, the challenges involved, and the risks to customers. Why Do Competing PV Products Want to Use Calibre SVRF? Calibre is a primary sign-off standard at all the major foundries and IDMs, and … Read More

Foundries, Fabless, Foundry, TVF, Translators, Direct Read, PV, Sign-off, DRC, SVRF, Calibre, Syntax, IC Design, Equation-Based DRC, IDM, Fab-lite, Native Read, Physical Verification, eqDRC

20 Nov, 2009

IBM Addresses Leakage

Posted by David Abercrombie

David Abercrombie

In case you missed the webinar by Jim Culp on November 3rd, I wanted to give you an opportunity to see what you missed. Jim is a Senior Engineer in IBM’s Advanced Physical Design and Technology Integration team. He is leading a team in the development of Parametric DFM and the mitigation of Circuit Limited Yield (CLY). During the webinar he discussed how CLY is becoming the leading contributor to yield

Read More

Physical Verification, Yield, DRC, Leakage, IC Design, Design Quality, IC Verification, Design for Manufacturing

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