DRC- and DFM-clean designs can still have hundreds to thousands of violations that must be debugged and corrected. How? Why? Mismatches between a router’s simplified tech file and the complete (and complex) signoff design rule decks at advanced nodes are generating significant numbers of DRC/DFM errors that can wreak havoc on your tapeout schedules. In particular, we’re seeing greater visibility … Read More
IC Design Blog
Posts tagged with 'tapeout'
It happens all the time, to all of us. You need a quick answer for a very specific question about using your EDA tools. You don’t want to wade through technical documentation, you don’t have time for an email response, and you really don’t want to try searching EDA forums for an answer. We feel your pain, and we decided to do something about it. Need to know how to extract a net from … Read More
Press releases can make it seem like EDA tool qualification for a particular IC process node is the “end game.” But in truth, qualification is just the first publicly visible step of ongoing collaborations between an EDA vendor and the foundry. Michael White takes you behind the curtain for a peek at what goes on during qualification from start to finish, as part of his ongoing Silicon Edge series … Read More
Jean-Marie Brunet examines the reasons why the “tapeout crunch” is getting worse and worse at advanced nodes, and suggests some possible solutions, in this forward-looking article written for SemiconductorEngineering.com. … Read More
The need for high reliability covers a wide array of market segments, all with differing acceptance requirements. In this video, Matt Hogan explores the challenges of comprehensive reliability verification, and demonstrates how Calibre PERC can help you satisfy the most demanding requirements with confidence. … Read More
- Lights! Camera! Multi-Patterning!
- Vector? Vectorless? What’s a power grid to do?
- Mentor's TSMC OIP Presentations Now Available!
- Variability is EVERYWHERE!
- UPDATE: Multi-Patterning Unmasked!!
- The Trouble with Triples—Part 2
- TSMC OIP presentations now available!
- FinFET Fever...or FinFET Fear?
- 2014 is Underway! What's on Your Calendar?
- Routing Closure Challenges at 28nm and Below
- March, 2014
- February, 2014
- January, 2014
- December, 2013
- Qualification Is Just the Beginning
- Pattern Matching: Blueprints for Further Success
- Mastering the Magic of Multi-Patterning
- The Trouble With Triples—Part 1
- Reducing the Tapeout Crunch with Signoff Confidence
- Foundry Solutions Video Blog: Calibre PERC
- Customizing Calibre Jobs without Editing Rule Decks
- Model-Based Hints: GPS for LFD Success
- October, 2013
- September, 2013
- July, 2013
- April, 2013
- March, 2013
- December, 2012
- March, 2012
- May, 2011
- April, 2011
- February, 2011
- January, 2011
- November, 2010
- August, 2010
- June, 2010
- May, 2010
- April, 2010
- March, 2010
- February, 2010
- January, 2010
- December, 2009
- November, 2009
- October, 2009
- September, 2009
- August, 2009
- July, 2009
- June, 2009
- "Waive" of the Future?
- How do you debug LVS?
- DFM for Non-PhD's: Part 2 - Reliability
- Mixed-Signal SoC Verification
- Process Variation: The Use of In-Die Variation
- DFM for Non-PhDs
- Calibre Everywhere -- the customer value of universal integration
- So, why not just write better rules?
- To be the man, you've gotta beat the man!
- Power in need, Power indeed
- May, 2009