The world’s most advanced computational fluid
dynamics simulation software.
The Mechanical Analysis Division of Mentor Graphics (formerly Flomerics) provides simulation software and consultancy services to eliminate mistakes, reduce costs, and accelerate and optimize designs involving heat transfer and fluid flow before physical prototypes are built.
Software Evaluation: Try concurrent FloEFD for Creo software, fully embedded in Creo Parametric and Wildfire. The 60 day trial software includes heat transfer, pressure drop, exhaust manifold, mixing armature and roof-mounted... View Software Evaluation
Software Evaluation: Download the free CFD software trial version of FloEFD™ for CATIA V5, the only fully embedded fluid flow and heat transfer simulation package for CATIA V5. View Software Evaluation
Tightly integrated with major MCAD systems including Pro/ENGINEER, SolidWorks, and CATIA, FloEFD is fully-featured 3D fluid flow and heat transfer analysis software. FloEFD
FloTHERM is a powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection and radiation. FloTHERM
Simulate and analyze designs quicker and easier with Mentor's Flowmaster 1D CFD solution for systems and FloEFD CAD-embedded Concurrent 3D CFD for components level analysis.
FloTHERM thermal analysis software and MicReD thermal characterization products and services help leading electronics companies around the world create faster, more reliable, and more profitable electronics products.
With every Kelvin increase in temperature, the risk of avionic component failure increases. For civil and military applications, the thermal characteristics of avionic components directly influence overall... View White Paper
The main source of heat in electronic equipment is their semiconductor chips, and the temperature sensitivities of these chips presents a challenge in designing cooling mechanisms. Overheating causes the... View White Paper
A new method based on existing measurement standards for a quick and repeatable thermal conductivity measurement of nanoparticle-based thermal greases and other compressible thermal interface materials... View White Paper
Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour…View Blog Post
A common enough question. Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. They should be called ‘area extenders’ as heat does not just disappear into…View Blog Post
I don’t know about you but I read. A lot… It’s almost as if I’ve got an unquenchable thirst for information. It all started when I was 6 during a school break. I was bored and pestered my mom one too many…View Blog Post