Mechanical Analysis
The world’s most advanced computational fluid
dynamics simulation software.
The Mechanical Analysis Division of Mentor Graphics (formerly Flomerics) provides simulation software and consultancy services to eliminate mistakes, reduce costs, and accelerate and optimize designs involving heat transfer and fluid flow before physical prototypes are built.
FloTHERM XT
Leading Innovation in Electronics Thermal Design. FloTHERM XT ensures data integrity through EDA and MCAD design flows.
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Software Products
FloEFD™
Tightly integrated with major MCAD systems including Pro/ENGINEER, SolidWorks, and CATIA, FloEFD is fully-featured 3D fluid flow and heat transfer analysis software. FloEFD
FloTHERM®
FloTHERM is a powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection and radiation. FloTHERM
Solutions
General Purpose CFD
Simulate and analyze designs quicker and easier with Mentor's Flowmaster 1D CFD solution for systems and FloEFD CAD-embedded Concurrent 3D CFD for components level analysis.
Electronics Cooling
FloTHERM thermal analysis software and MicReD thermal characterization products and services help leading electronics companies around the world create faster, more reliable, and more profitable electronics products.
Building Heating and Ventilation
Optimize airflow, temperature distribution, and contamination control in and around buildings and vehicles with FloVENT airflow modeling software. Our Data Center cooling simulation tools lead the industry.
White Papers
Tackling the Thermal Design Challenges of Smaller, Lighter, and More Efficient Avionics
With every Kelvin increase in temperature, the risk of avionic component failure increases. For civil and military applications, the thermal characteristics of avionic components directly influence overall... View White Paper
A Step Change in Electronics Thermal Design: Incorporating EDA and MDA Design Flows
The main source of heat in electronic equipment is their semiconductor chips, and the temperature sensitivities of these chips presents a challenge in designing cooling mechanisms. Overheating causes the... View White Paper
New Method for Characterizing Thermal Interface Materials in an In Situ Environment
A new method based on existing measurement standards for a quick and repeatable thermal conductivity measurement of nanoparticle-based thermal greases and other compressible thermal interface materials... View White Paper
Blogs
Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour…View Blog Post
Why Not Just Shove a Heatsink on Top of it? Part 1
A common enough question. Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. They should be called ‘area extenders’ as heat does not just disappear into…View Blog Post
Hot Off the Press
I don’t know about you but I read. A lot… It’s almost as if I’ve got an unquenchable thirst for information.
It all started when I was 6 during a school break. I was bored and pestered my mom one too many…View Blog Post
Customer Success
Schüco International
Schuco uses FloTHERM computational fluid dynamics software to design more efficient photovoltaic panels and gain significant competitive advantage.
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