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Mechanical Analysis Blog

19 Sep, 2014

Robin Bornoff A recently issued patent describes a process by which the critical IC temperature (junction temperature, Tj) can be determined in an end user environment. A critical junction temperature is one that, should the IC temperature go beyond it, will continue to increase in a thermal runaway scenario. In other words the environment in which the IC is operating can’t get the heat out quick enough. The … Read More

18 Sep, 2014

Don Miller In this blog series I will cover the historical context which lead to the creation of Internal Flow Systems.  Covering both the motives and the methods behind the book and inevitably raises questions about the reliability of many of the other available sources of available data.  It will also make it clear that this isn’t a subject of academic interest alone; the subject of loss coefficients and system … Read More

16 Sep, 2014

Nazita Saye In my job I need to exercise a fair bit of creativity. Sometimes my ideas are readily picked up. Some require a lot of massaging and some never see the light of day… I used to take criticism of my ideas personally but not since hanging out with engineers. If there’s one thing I’ve learned from you guys is that there’s no such thing as failure – only outcomes. As Thomas Edison famously said “I … Read More

8 Sep, 2014

Dell Precision - Spot on Thermal Design

Posted by Robin Bornoff

Robin Bornoff Develop 3D is a UK based Magazine and Website focussing on the technologies involved in product design. The latest copy had a fascinating article on Dell’s Precision Workstation labs. This blog is being written on a Precision M4500 which I’ve lugged around countless airports and dumped, wearily, on numerous hotel beds. The fact that it works as well now as when I first got it a few years ago is … Read More

5 Sep, 2014

System Simulation in the Cloud

Posted by Doug Kolak

Doug Kolak Do you have an upcoming project and don’t have a tool that can handle system level thermo-fluid analysis? Are you evaluating your current simulation options to make sure they meet the needs of your business for years to come? Are you curious about new ways of solving problems of the world today in particular with the use of CFD? If you are like most engineers I speak with, the process for getting access … Read More

4 Sep, 2014

Robin Bornoff A release so good it has 11 best top 10 features, very Spinal Tap. I thought I’d wrap up this series with a list of more minor, but imo, very useful features and finish off with some words on cultural idioms. FloTHERM V10.0 and V10.1 together satisfy about 60 software enhancement requests as voted for on the Mentor IDEAS site for Mechanical Analysis Products, a strategy we’ve been committing … Read More

4 Sep, 2014

Robin Bornoff Arguably the most important (and often least well characterised) parameter controlling the temperature of electronic products is their power dissipation. Usually dissipated on the active layer of a die, this heat power seeps through the die, package, PCB, air, chassis all the way to the ambient in which the product sits. The less heat power the better, the lower the temperature rises that occur. The … Read More

4 Sep, 2014

Robin Bornoff FloVENT, FloTHERM’s sister product aimed at 3D CFD simulation of the built environment, has for many years been able to simulate the thermal behaviour of a data center. After all a data center is a built environment, albeit more for servers and the like than humans. We’ve not changed this capability of FloVENT but we have copied the relevant data centric features over to FloTHERM, extending … Read More

3 Sep, 2014

John Parry Come and join us for THERMINIC 2014 in (hopefully) sunny London! The 20th IEEE Workshop on THERMAL INVESTIGATIONS OF IC’s AND SYSTEMS (THERMINIC 2014) to be held at the magnificent World Heritage Site in Greenwich, London, is on 24-26 September. This year, as part of the 20th Anniversary celebrations, there will be a boat trip up the river Thames, followed by a trip around the London Eye! It’s a great … Read More

29 Aug, 2014

Robin Bornoff Electronics thermal simulation historically focussed on steady state conditions, worse case scenarios where for example a power dissipation is assumed at a maximum and unchanging. Not a direct reflection of reality but the conservative (over)temperature simulation results enabled design margins to be implicitly factored in. Over the years, as margins reduced and the need for ever more accurate simulations … Read More

26 Aug, 2014

Hot Days of Summer

Posted by Nazita Saye

Nazita Saye I moved to England 10 years ago – actually it’ll be 10 years come September 1st. During this time I have seen rain, rain and even more rain. I’ve even lived through some tepid winters and downright cold summers.  In fact, I’ve adopted an endearing habit of the English and have become obsessed with the weather. Take last year for example. We had some nice weather in April (chilly but with warm sun so … Read More

15 Aug, 2014

Try before you buy

Posted by Nazita Saye

Nazita Saye I’m a keen walker and hiker. I prefer 10-15 mile excursions – anything short of 8 miles is hardly worth getting out of bed for and anything over 15 miles can be challenging (especially if there are lots of hills involved). Last month a friend of mine cajoled me into signing up for a charity walking marathon. The 26.2-mile walk starts at 9 pm in London and continues until the morning (here’s a … Read More

23 Jul, 2014

Busting Myths

Posted by Nazita Saye

Nazita Saye I went out to a dinner party this past Saturday. I sat next to an ex-colleague who I now consider among my dearest friends. I met him five jobs ago – a while back we decided that it was kinder to our psyche to talk about jobs as opposed to the number of years. He is a brilliant engineer and has many years of simulation software use under his belt. He leads a team of several junior engineers who work … Read More

18 Jul, 2014

Robin Bornoff I’m sure in the (far) future, product design and manufacture will just involve a big box that you can ask to make things for you. “A leg driven transport device with communication, health monitoring and illumination functions that will last me the week. Please Mr. Box” (or ‘Bob the making box’ as I’d call mine). Out it would pop. Think Star Trek Next Generation Replicator, … Read More

30 Jun, 2014

Robin Bornoff If there’s one word that describes electronics products it’s ‘complexity’. Actually, scratch that, that’s too generic a term. How about ‘cluttered’? IC packages are constructed from a number of different parts, soldered onto a PCB that is constructed from a series of layers and secured into some kind of chassis. ‘Packaging’ at various levels, physically … Read More

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