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Going MAD at European Solutions Expos

John Parry

John Parry

Posted Oct 15, 2009

I’d expected to be posting about FloTHERM.PACK this time, but I thought I’d better let you know what I’ve been working on the last couple of weeks instead. I’ve been putting together the Mechanical Analysis Division’s presentations for the European Solutions Expos in Finland, The Netherlands, Sweden, and Egypt amongst other places, plus the Alcatel Thales forum in Paris and U2U in Munich. Details of these are still being posted so bookmark the Solutions Expos link for an event near you.

The focus of this year’s events is solexpo-09-bw

which is right on topic for the current business climate. The Mechanical Analysis Division as a great story to tell about how attention to thermal design can deliver considerable overall savings in cost and time during design. We have hard evidence gathered independently by Aberdeen Research that using FloTHERM and FloTHERM.PCB results in a significant reduction in the number of PCB re-spins and the time companies spend completing thermal verification at the end of the design, which will be presented.

Electronics miniaturisation doesn’t just increase power density and hence the thermal design challenge, it also brings the mechanical and electrical design flows much closer together. Companies that are able to foster greater collaboration between the electrical and mechanical design communities are likely to distinguish themselves in the marketplace.

Next time you use your mobile phone, PDA or notebook computer which we all take for granted these days, spare a thought for the mechanical complexity of the product and the challenge of getting the heat out. With 75% of the top 100 electronics companies being Mechanical Analysis Division customers, chances are that it was designed using our software.

Dr. J, Hampton Court

Solutions Expo, FloTHERM.PACK, Design Process, Saving Cost, Saving Time, FloTHERM.PCB, PCB Respin

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About John Parry

John ParryI started my career in the consultancy group at CHAM Ltd., using PHOENICS for a variety of CFD applications. From the consultancy group I moved into support, helping customers debug models, and figuring out how to model new applications. That broadened into delivering training courses and creating training material. I was invited to join Flomerics when it started in 1989 to head up Customer Services, and I jumped at the chance to work for a startup. After a few years supporting customers using FloTHERM I moved across into research, developing thermofluid models of common electronic parts, like fans and IC packages, later managing the DELPHI and SEED projects. More recently I worked with Flomerics’ Finance Director on the acquisition of MicReD, helping to integrate MicReD’s business into Flomerics Group which was great fun. Since Flomerics acquired Nika, I’ve been responsible for promoting the FloEFD suite in education, and moved into marketing. I now work as part of the Mechanical Analysis Division’s Corporate Marketing group, responsible for ElectronicsCooling Magazine and the division’s Higher Education Program. Expertise: I’m a chemical engineer by training and did a PhD in reactor design before getting involved with CFD more than 25 years ago. Visit John Parry’s Blog

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