I’d expected to be posting about FloTHERM.PACK this time, but I thought I’d better let you know what I’ve been working on the last couple of weeks instead. I’ve been putting together the Mechanical Analysis Division’s presentations for the European Solutions Expos in Finland, The Netherlands, Sweden, and Egypt amongst other places, plus the Alcatel Thales forum in Paris and U2U in Munich. Details of these are still being posted so bookmark the Solutions Expos link for an event near you.
The focus of this year’s events is
which is right on topic for the current business climate. The Mechanical Analysis Division as a great story to tell about how attention to thermal design can deliver considerable overall savings in cost and time during design. We have hard evidence gathered independently by Aberdeen Research that using FloTHERM and FloTHERM.PCB results in a significant reduction in the number of PCB re-spins and the time companies spend completing thermal verification at the end of the design, which will be presented.
Electronics miniaturisation doesn’t just increase power density and hence the thermal design challenge, it also brings the mechanical and electrical design flows much closer together. Companies that are able to foster greater collaboration between the electrical and mechanical design communities are likely to distinguish themselves in the marketplace.
Next time you use your mobile phone, PDA or notebook computer which we all take for granted these days, spare a thought for the mechanical complexity of the product and the challenge of getting the heat out. With 75% of the top 100 electronics companies being Mechanical Analysis Division customers, chances are that it was designed using our software.