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Measuring the real world - at least the thermal properties of semiconductor device packages

Andras Poppe

Andras Poppe

Posted Nov 15, 2010
1 Comment

So, there we are. Finally. I am always reluctant to start with fancy features of Web 2.0. I have resisted for quite a while to be present on FB. When many young colleagues around me started using terms such as Giga-like (meaning “I like it a lot”) I just thought, I had to learn about this a bit. Also, from time to time I read blog entries on culture and politics. Sometimes they are quite interesting… Then I’ve seen Mentor blog posts from my friends at the Hampton Court office providing lots of interesting thoughts, views and ideas about CFD and FloTHERM in particular, I just thought I also could share with interested readers great many things about T3Ster and TERALED.

Yes, these funny words are the names of Mentor’s thermal testing hardware solutions aimed at physical testing of the thermal properties of packaged semiconductor devices. These are called the MicReD products. T3Ster stays for THE thermal transient tester – a sophisticated test system who’s name starts with three T-s, therefore we could not name it anything else like “3-ster” (say tri-ster). TERALED is also a speaking name which, I believe is easy to understand both by native English speakers and by any other human being who speaks some technical English like me – a native Hungarian. TERALED simply stays for Theramal and RADiometric testing of LEDs – an add-on solution to T3Ster which is specifically aimed at comprehensive testing of power LEDs.

In my first post I do not think I should write anything technical about our equipment and related software solution (what we simply call the MicReD T3Ster-technology) since over the last decade the MicReD team jointly with researchers from the Department of Electron Devices of the Budapest University of Technology and Economics have published great number of technical papers on thermal testing and compact thermal modeling of packaged semiconductor devices, stacked die packages, power LEDs, die attach testing and most recently about testing of TIM – as key contributors to the NANOPACK project of the FW7 program of the EU. Some of these papers and others are downloadable from Mentor’s web site as whitepapers and webinars on LED thermal testing and system level thermal testing are also available as video on demand.

With the launch of the Mentor Graphics Thermal Testing Hardware blog I plan to provide quick updates on recent events and developments, provide links to interesting topics, conference papers, technical news and so on. Simply, I plan to provide information about how to measure the thermal world of real semiconductor devices.

So, 15th of November is a birthday. Not only mine. It is the birthday of this blog. Long live the thermal testing hardware blog – welcome to read this!

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About Andras Poppe

Andras PoppeI graduated in 1986 at BME - the Budapest University of Technology as an electrical engineer. After graduation I started working at the Department of Electron Devices (now this is the microelectronics department) of the same university. I was dealing with microelectronics CAD and CAD tool development: I re-implemented a circuit simulator with electro-thermal simulation capabilities in C for PC-s. In 1989-90 I worked as a guest researcher at IMEC (Leuven, Belgium). In 1996 I obtained my PhD degree at BME in the field of semiconductor device simulation. With my PhD work I contributed to the development of a molecular dynamics based Monte Carlo MOS simulator. At the same time I started dealing with thermal modeling and simulation. In 1997 with my former professor and other colleages we created a spin-off company called MicReD. At MicReD we developed a commercial thermal transient tester equipment (today called T3Ster) which was first uesed by European simiconductor manufacturers within the European founded thermal research project PROFIT. The equipment and its related results post processing software called T3Ster-Master became very successful. As power LEDs appeared in the market, their thermal testing needed special care: during thermal characterization the energy emitted in form of light had to be measured as well. That's how our TERALED product was born - also in a close cooperation with BME. After a couple of mergers our divison is now the manufacturer of the MicReD products which are sold all over the world by Mentor Graphics' Mechanical Analysis Division. I am still involved in electro-thermal simulation of circuits as well as multi-domain characterization of LEDs. My major responsibility at Mentor Graphics is the marketing and business development of the MicReD products (T3Ster and TERALED). Visit Thermal testing: measuring the real world

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Comments 1

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Happy birthday blog (and Andras). May the blog live long so we can all learn more about the sector, the market trends and the technologies making engineering life easier.

Nazita Saye
9:06 AM Nov 16, 2010

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