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Modelling and Simulating a PC with FloEFD (Part 3)
Modelling and Simulating a PC with FloEFD (Part 3)
Posted Feb 23, 2010, by Boris Marovic
Tags: FloEFD, FloEFD Project, Electronics Cooling, Thermal Design
Ok, last time I promised you to put a picture of me as Dr. Zoidberg from Futurama on here. Well here it is! What do you think?
Now back to the PC model. In the post before the last one I said I will show you the Mainboard and its main features. As you can see I modelled the heat sink in pretty good detail. I did that to show you a little feature of FloEFD™V5 or better said in all of our FloEFD products. But we will get to that when the time of simulating has arrived, but first more about the Mainboard. The Mainboard was at least at the time I bought it one of the newest of it’s kind. I has all the features such as DrMOS instead of Discrete MOS which means less power consumption, lower temperature of the MOS and more stable overclocking (in my case I didn’t overclock). A lot of very nice bright blue SMD LEDs for status displays on the board and some other nice to have features such as easy BIOS update etc. The main interest when modelling the Mainboard were the heat sources with heat sinks, all the card slots such as PCI-Express, DDR3 slots, Heat Pipe and the chip socket with chip. I cannot tell what kind of chip it is but it is a quad core with 2.67 GHz. I used also all six DDR3 slots with each occupied with a 2GB RAM module. The Heat Pipe you can see is connecting the two chipsets and the third heat sink which is not connected, the one close to the USB, LAN and other ports at the back side of the Mainboard is placed on the DrMOS.
Preparing RecommendationsWell this is how the Mainboards looks like with its most important features. The next thing I will do is to get some more information on the chips, for the definition of the heat sources and their material properties. So if this is done we could do a test calculation of the Mainboard without graphic card, RAM and the surrounding casing.
So, see you next time…
About Boris Marovic
I studied Aeronautical Engineering at the University of Stuttgart (Germany) and did my final thesis at the AME of the University of Arizona (USA). I started in 2007 directly at Mentor Graphics (at that time NIKA/Flomerics) and am working in the customer support for the FloEFD products, demoing the software and giving trainings for the FloEFD products.
Basically I'm interested in almost every engineering simulation there is. I did work a little with the FEM stress simulation of Catia V5 and ever since I liked the idea of simulating in the design process and that's how I found my way to FloEFD.
Well I have some hobbies like Skiing, skating, my dog (she's a cutie but sometimes can be a real little gremlin). I really like aircrafts, but rather military jets than commercial aircrafts and I like designing. Modeling something really nice like a car or even a simple fixture gives me always the feeling of satisfaction when seeing the final version and being proud of my creation. Maybe you know the feeling when you created something and then leaning back watching at it and thinking "Yep, that's my baby!".
Oh, and not to forget, I love motorcycles primarily supersport. Every spring when all the bikers crawling out of their holes and you hear the sounds of roaring engines I have goose bumps all over my back. Unfortunately I currently don't have a bike on my own but that'll change hopefully soon.
Visit Boris Marovic’s Blog
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More Blog Posts
Preparing RecommendationsRecent Posts
- Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures
- Bottlenecks and Interface Materials; Part 2 - When TIMs Go Bad
- Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point
- Bottlenecks and Interface Materials; Part 1 - Great Thermal Bedfellows
- Is Pipe Insulation Effective?
- Emails, more Emails and Jeff Bridges
- LEDs; The future's bright and hot.
- From Megawatts to Milliwatts; sub-micron scale thermal modelling with FloTHERM
- Not a Good Day
- What! All that just for that? The bonkers world of CPU cooling.
Archives
- February, 2012
- January, 2012
- Bottlenecks and Interface Materials; Part 2 - When TIMs Go Bad
- Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point
- Bottlenecks and Interface Materials; Part 1 - Great Thermal Bedfellows
- Is Pipe Insulation Effective?
- Emails, more Emails and Jeff Bridges
- LEDs; The future's bright and hot.
- December, 2011
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- Come, meet FloTHERM/VENT/EFD users, learn and enjoy!
- The Future of Air Travel
- PC Overclocking and Aftermarket Modding. Part III - Power vs. Frequency?
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- Mechanical U2Us are Here!
- PC Overclocking and Aftermarket Modding. Part II - Liquid Nitrogen Overclocking, How Cool is That?
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- Beer Fridge - A Case Study in Thermal Design. Part 1 - A Gift
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Comments (↓ Add Your Own)
2 Comments on this Post
Commented on 9:36 PM, Feb 13, 2011
By Volkan KARAKUS
Commented on 8:44 AM, Mar 14, 2011
By Boris Marovic
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