Sign In
Forgot Password?
Sign In | | Create Account

New Beginnings

As of late our Blog has become rather inactive. Not that we are not interested in writing anymore, but we are so. Darn. Busy. New products, new problems that need solving, and of course new ideas. However, it seems that there is a light at the end of the tunnel and there is a silhouette of a man that would like to welcome you to my first installation of our revived Blog. If the analogy doesn’t sit well with you, then it might be easier to picture me in a Lab Coat, engulfed by several LEDs, standing in a dimly lit hallway.

I am not entirely sure where my posts will be headed, but I believe it is a good thing. That means I can talk about anything I want, where it will ultimately result in some discussion for thermal problems. So maybe I am lying, when I say “anything”. I will actually only write about all the fun we can have with thermal transient testing and related topics. The blurb about me talking about saying anything I want, is actually only a disclaimer that you can’t hold all the bad jokes and puns against me.

However, as it has been a while since we spoke of thermal characterization, I think this is an opportune moment to get back into the basics. As in every discipline the basics are important… Or at least that is what my basketball coach would yell at me, before tossing his clipboard to the ground in a rage and making me run suicide drills. As I can’t force anyone to sprint (sadly), I will try to convey everything in an entertaining manner.

Thermal testing can be done in many ways. We know that. And for those who don’t, time to listen up! T3ster is based on the “Electrical Test Method”. The Electrical Test Method is also governed by the JEDEC JESD 51-1 Standard and has several advantages:

1. Uses intrinsic properties of semiconductors
2. Allows for a thermal characterization of device layers and systems
3. It is Non-Destructive

Though the word “Standard” sounds dry, long-wound and boring, It offers much valuable information on how the thermal test should be conducted, and some “under-the-hood” information for our T3ster Software. So, how do we conduct a good test?

The beginner might assume that it would suffice to wildly flap your hands at the device, and blow air at it until you collapse from a self-induced oxygen-high. But the more expert people amongst us would ask some questions first.

– What are the constraints (power, max temperature etc.)?
– What am I trying to measure? How will my testing time be affected?
– What is my maximum temperature difference I need
– Is it in-situ? Or a single device?
– What is the best way to set up my test in order to get the maximum data from it?

And last, but not least

– How do I evaluate my results in post-processing?

So, as this is my warm-up, I will already threaten you with the promise that I will discuss these questions, the general test method in upcoming posts and related thoughts. I hope you look forward hearing from me, as much as I look forward to hearing from myself.
Mathew Clark
Field Application Engineer – Europe

#Electronics, #JEDEC, #cooling, #thermal, #T3ster, #testing

More Blog Posts


No one has commented yet on this post. Be the first to comment below.

Add Your Comment

Please complete the following information to comment or sign in.

(Your email will not be published)


Online Chat