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Ramping Up for THERMINIC! Abstract Deadline 28th May 2014

John Parry

John Parry

Posted May 15, 2014

Come and join us for THERMINIC 2014 in London!

The first deadline for abstract submissions to the 20th IEEE Workshop on THERMAL INVESTIGATIONS OF IC’s AND SYSTEMS (THERMINIC 2014) to be held at the magnificent World Heritage Site in Greenwich, London, has now passed.

We’ve had a great response to the first call for abstracts, with more abstracts submitted this year compared to last year. The quality of abstracts submitted so far means that we are expecting a very high quality technical programme including keynote presentations from leading experts in the field.

Due to the May Day holiday period we have had a number of requests to extend the deadline. This has he extended deadline is now 28th May 2014. This is the final deadline, so if you wish to submit an abstract and join us for this special anniversary event please note this date!

Further information on the workshop, social events, and call for papers can be found at the conference website.

Mentor are both sponsoring the conference and exhibiting, so if you want to find out the latest news do come and visit our booth.

New this year is a Special Session on Power Electronics, which is proving to be a very popular topic at the moment. Mentor have just announced our latest product, and the first in our MicReD Industrial product line – the Power Tester 1500A for Power Cycling and Thermal Testing of Electronic Components.

I’m also organizing a Special Session on the ‘Industrial Use of Compact Thermal Models’ to gauge the impact these are having on thermal design. I’ve already got a great set of speakers from industry lined up, but if you are interested in submitting an abstract then please email me directly.

In case of questions please don’t hesitate to contact either myself or the Conference Chair Prof. Chris Bailey through the THERMINIC Conference Office. If you can’t make it, but would like to be put on the mailing list for future events, then please drop an email to the Conference Office.

We look forward to seeing you at THERMINIC 2014 in Greenwich.

Dr J.

Thermal measurements, THERMINIC, Compact Thermal Models, CTMs, CFD, Thermomechanical reliability

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About John Parry

John ParryI started my career in the consultancy group at CHAM Ltd., using PHOENICS for a variety of CFD applications. From the consultancy group I moved into support, helping customers debug models, and figuring out how to model new applications. That broadened into delivering training courses and creating training material. I was invited to join Flomerics when it started in 1989 to head up Customer Services, and I jumped at the chance to work for a startup. After a few years supporting customers using FloTHERM I moved across into research, developing thermofluid models of common electronic parts, like fans and IC packages, later managing the DELPHI and SEED projects. More recently I worked with Flomerics’ Finance Director on the acquisition of MicReD, helping to integrate MicReD’s business into Flomerics Group which was great fun. Since Flomerics acquired Nika, I’ve been responsible for promoting the FloEFD suite in education, and moved into marketing. I now work as part of the Mechanical Analysis Division’s Corporate Marketing group, responsible for ElectronicsCooling Magazine and the division’s Higher Education Program. Expertise: I’m a chemical engineer by training and did a PhD in reactor design before getting involved with CFD more than 25 years ago. Visit John Parry’s Blog

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