Call me jaded but there are times when I read new product press releases with a bit of trepidation – can the product really be new and improved? Or is it just a minor enhancement to existing functionality?
But from time to time you do come across some real gems.
- Optimized heatsink design with FloTHERM 9. Image courtesy of Mentor Graphics.
Earlier this week we announced the release of FloTHERM 9 – the market leading CFD solution for electronics cooling applications. While FloTHERM has been around for a good many years, FloTHERM 9 includes some truly revolutionary new patent-pending technology. FloTHERM provides Bottleneck (Bn) and Shortcut (Sc) fields so engineers can identify not only where heat flow congestion occurs in the electronic design but also why!
The Bn and the Sc fields raise use of simulation from just an observation tool for identifying heat management problems to a proper problem-solving tool which can guide the designer by suggesting potential solutions. The Bn field highlights the congestion area in a design heat path; therefore, by making a design change to these bottleneck areas you can relieve the heat flow problem. The Sc field can highlight possible solutions where the addition of another element to the design yields even more effective paths for further cooling. By using these two new features, you can replace expensive “trial and error” iterations with a guided “what if” so you can solve heat management issues faster and more efficiently.
For the sake of brevity I won’t go into all the technical details … several articles have already been written about the technology and if you haven’t had a chance to read them, please feel free to read a handful here:
- A New Angle - Mentor’s New Approach to Keeping the Hot from Getting Hotter, IC Design and Verification Journal
- Technical brief: thermal bottlenecks and shortcut opportunities; innovations in electronics thermal design simulation, Electronics Cooling Magazine
- Industry’s first thermal analysis bottleneck and shortcut capabilities, MCAD Online
- Mentor Graphics talks about its new CFD analysis software and heat flow congestion in chip design, ELECTROIQ
If you are intrigued and would like to learn more about this truly unique technology, then I’d like to encourage you to attend a free online presentation on the technology and how it can be applied to everyday thermal design. The presentation, Identifying Thermal Bottlenecks and Shortcut Opportunities, will be held on November 3rd and will be broadcast live twice – 11 AM London time and 11 AM US Eastern time. For additional information or to register please click here. The presenter, Dr. Robin Bornoff, is the product manager for FloTHERM and is one of the experts behind the Bn and Sc technologies. He is an all around fantastic presenter and I’m sure you’ll find this session very interesting.
Until next time,