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Semiconductor Package Thermal Characterization and Design as Easy as 1-2-3
Semiconductor Package Thermal Characterization and Design as Easy as 1-2-3
Posted Feb 24, 2010, by Nazita Saye
Tags: Semiconductor, ROI, Smart Parts, CFD, FloTHERM, BGA Substrates, Thermal Characterization, JEDEC, Package Design, Validation, FloTHERM IC, FloTHERM PACK
If you are involved with semiconductor packaging design, then have I got news for you.
We just announced the availability of FloTHERM IC – a web-based tool that delivers a high level of automation to design tasks associated with full-spectrum thermal characterization and validation.
From what I understand, a typical semiconductor thermal team spends about 60% of their time on standard package thermal characterization and design. The remainder of their time is spent on customer specific characterization. What’s neat about FloTHERM IC is that it automates the process so you can drastically reduce not only the time spent on the standard package design but also on the customer specific characterization as well. And FloTHERM IC includes pre-verified thermal models which can reduce the risk of modeling errors. Nice.
So what are the areas addressed by FloTHERM IC:
- Full-spectrum thermal metric and compact model generation with full adherence to published JEDEC standards
- “Package-aware” parametric design for “what-if” analysis
- EDA tool interfacing for detailed modeling of BGA substrates for physical layout
- Data mining of simulation data to enable optimized design time and reuse
Preparing RecommendationsI should point out that FloTHERM IC uses FloTHERM CFD software as its analysis engine (the number one software of choice for thermal engineers around the world) and it uses FloTHERM PACK Smart Parts which help reduce risk of modeling errors. And FloTHERM IC has a wizard-based interface which makes using it very intuitive. For additional information about FloTHERM IC and what it can do, please follow this link.
Since this blog is all about ROI, then let’s talk about how you can try FloTHERM IC for free. You can request a free 30-day trial version from here. Please bear in mind that you will be using the production-version of the software so you can use it to work on your real projects — not some canned stuff. 23 of the top 50 semiconductor companies use our products so you’ll be in very good company.
Until next time,
Nazita
About Nazita Saye
I have been involved with the CFD user community in one shape or another since 1999 -- when the NIKA team first introduced FloWorks to the engineering community. Over the years I've seen the market evolve and I still marvel at the wide range of products that are being designed with our tools. As the Manager of Communications and Field Marketing for the Mechanical Analysis Division at Mentor, it is my privilege to bring some of our customer stories to you.
Visit CFD doesn’t mean Color For Directors
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Preparing RecommendationsRecent Posts
- Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures
- Bottlenecks and Interface Materials; Part 2 - When TIMs Go Bad
- Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point
- Bottlenecks and Interface Materials; Part 1 - Great Thermal Bedfellows
- Is Pipe Insulation Effective?
- Emails, more Emails and Jeff Bridges
- LEDs; The future's bright and hot.
- From Megawatts to Milliwatts; sub-micron scale thermal modelling with FloTHERM
- Not a Good Day
- What! All that just for that? The bonkers world of CPU cooling.
Archives
- February, 2012
- January, 2012
- Bottlenecks and Interface Materials; Part 2 - When TIMs Go Bad
- Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point
- Bottlenecks and Interface Materials; Part 1 - Great Thermal Bedfellows
- Is Pipe Insulation Effective?
- Emails, more Emails and Jeff Bridges
- LEDs; The future's bright and hot.
- December, 2011
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- PC Overclocking and Aftermarket Modding. Part III - Power vs. Frequency?
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- Mechanical U2Us are Here!
- PC Overclocking and Aftermarket Modding. Part II - Liquid Nitrogen Overclocking, How Cool is That?
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- FloEFD HVAC Module - Taking Built Environment CFD Simulation to the Next Level
- Beer Fridge - A Case Study in Thermal Design. Part 5 - Time for a FloBEER
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- Lies, Damned Lies, and “CFD Comparison Charts” – Part IV
- Lies, Damned Lies, and “CFD Comparison Charts” – Part III
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