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Mechanical Analysis Blog

4 Sep, 2014

Robin Bornoff A release so good it has 11 best top 10 features, very Spinal Tap. I thought I’d wrap up this series with a list of more minor, but imo, very useful features and finish off with some words on cultural idioms. FloTHERM V10.0 and V10.1 together satisfy about 60 software enhancement requests as voted for on the Mentor IDEAS site for Mechanical Analysis Products, a strategy we’ve been committing … Read More

4 Sep, 2014

Robin Bornoff Arguably the most important (and often least well characterised) parameter controlling the temperature of electronic products is their power dissipation. Usually dissipated on the active layer of a die, this heat power seeps through the die, package, PCB, air, chassis all the way to the ambient in which the product sits. The less heat power the better, the lower the temperature rises that occur. The … Read More

4 Sep, 2014

Robin Bornoff FloVENT, FloTHERM’s sister product aimed at 3D CFD simulation of the built environment, has for many years been able to simulate the thermal behaviour of a data center. After all a data center is a built environment, albeit more for servers and the like than humans. We’ve not changed this capability of FloVENT but we have copied the relevant data centric features over to FloTHERM, extending … Read More

3 Sep, 2014

John Parry Come and join us for THERMINIC 2014 in (hopefully) sunny London! The 20th IEEE Workshop on THERMAL INVESTIGATIONS OF IC’s AND SYSTEMS (THERMINIC 2014) to be held at the magnificent World Heritage Site in Greenwich, London, is on 24-26 September. This year, as part of the 20th Anniversary celebrations, there will be a boat trip up the river Thames, followed by a trip around the London Eye! It’s a great … Read More

29 Aug, 2014

Robin Bornoff Electronics thermal simulation historically focussed on steady state conditions, worse case scenarios where for example a power dissipation is assumed at a maximum and unchanging. Not a direct reflection of reality but the conservative (over)temperature simulation results enabled design margins to be implicitly factored in. Over the years, as margins reduced and the need for ever more accurate simulations … Read More

26 Aug, 2014

Hot Days of Summer

Posted by Nazita Saye

Nazita Saye I moved to England 10 years ago – actually it’ll be 10 years come September 1st. During this time I have seen rain, rain and even more rain. I’ve even lived through some tepid winters and downright cold summers.  In fact, I’ve adopted an endearing habit of the English and have become obsessed with the weather. Take last year for example. We had some nice weather in April (chilly but with warm sun so … Read More

15 Aug, 2014

Try before you buy

Posted by Nazita Saye

Nazita Saye I’m a keen walker and hiker. I prefer 10-15 mile excursions – anything short of 8 miles is hardly worth getting out of bed for and anything over 15 miles can be challenging (especially if there are lots of hills involved). Last month a friend of mine cajoled me into signing up for a charity walking marathon. The 26.2-mile walk starts at 9 pm in London and continues until the morning (here’s a … Read More

23 Jul, 2014

Busting Myths

Posted by Nazita Saye

Nazita Saye I went out to a dinner party this past Saturday. I sat next to an ex-colleague who I now consider among my dearest friends. I met him five jobs ago – a while back we decided that it was kinder to our psyche to talk about jobs as opposed to the number of years. He is a brilliant engineer and has many years of simulation software use under his belt. He leads a team of several junior engineers who work … Read More

18 Jul, 2014

Robin Bornoff I’m sure in the (far) future, product design and manufacture will just involve a big box that you can ask to make things for you. “A leg driven transport device with communication, health monitoring and illumination functions that will last me the week. Please Mr. Box” (or ‘Bob the making box’ as I’d call mine). Out it would pop. Think Star Trek Next Generation Replicator, … Read More

30 Jun, 2014

Robin Bornoff If there’s one word that describes electronics products it’s ‘complexity’. Actually, scratch that, that’s too generic a term. How about ‘cluttered’? IC packages are constructed from a number of different parts, soldered onto a PCB that is constructed from a series of layers and secured into some kind of chassis. ‘Packaging’ at various levels, physically … Read More

26 Jun, 2014

Nazita Saye Recently a couple of my friends came to England to do a grand tour of the island. We arranged to meet half-way through their three week journey. The plan was simple. I would take the train from London to Norwich where they’d pick me up and we’d drive 181 miles north to York for the weekend. By we I mean Alan was going to drive while Susan and I were going for a ride. A perfect opportunity to catch up … Read More

10 Jun, 2014

Robin Bornoff Flo. As far as prefixes go, I don’t know of another company that uses one so consistently for product branding, well apart from Apple. ‘Flo’ comes from ‘Flow’ and was part of the naming of Flomerics (Flow-Numerics), the company that first developed FloTHERM (flow-thermal) and FloVENT (flow-ventilation). FloMOTION was a favourite branding (animated post-processing module). … Read More

5 Jun, 2014

Air Rage... no more?

Posted by Nazita Saye

Nazita Saye I’ve been traveling a lot lately – a bit for business, a bit for pleasure. Being a seasoned traveler I refuse to fly budget airlines. Call me a snob but I like certain creature comforts. You can take away your packets of peanuts/pretzels. You can get me to pay for my meals and drinks. However, I draw the line at legroom. I’m used to rubbing knees and shoulders with strangers while traveling on trains … Read More

3D CFD, Airflow, environmental control systems, Passenger Comfort

4 Jun, 2014

Robin Bornoff FloTHERM’s strength has always its been its robustness, founded on a simplicity of technology that we’ve tried not to compromise over its 25 year life. This is no truer than in its 3D CAD drawing interface. More Lego than Sculpting in its capabilities, it’s always been quick and easy to mock up a conceptual cooling architecture for a proposed design. FloTHERM V10 provides a step change … Read More

3 Jun, 2014

Robin Bornoff Temperature has always been, and will continue to be, a good enough leading indicator of product reliability. As a parameter it is easy to specify a maximum rating value and relatively easy to measure. However it is not temperature itself that directly causes product failure, more often than not it is some kind of mechanical fracture or deformation that itself is fuelled by thermo-mechanical effects. … Read More

ANSYS, Abaqus, thermo-mechanical, MpCCI

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