Posted Mar 9, 2010, by John Parry
I’m just back from a very productive SEMI-THERM Conference where we launched our new FloTHERM IC product. We had meetings with the editors of 5 leading electronics magazines to coincide with the launch, which was made at our vendor presentation during the exhibition at the start of Tuesday afternoon. Well done to all involved! If you want to see what others are saying about FloTHERM IC check out the … Read More
Tags:
Thermal Design,
SEMI-THERM Conference,
Thermal Management,
DELPHI Model,
Electronics Cooling,
2-Resistor Model,
JEDEC,
JEDEC JC15,
FloTHERM IC
Posted Nov 4, 2009, by John Parry
In “What’s black and stuck on a PCB?” I promised I’d get back to writing about FloTHERM.PACK and how it can really help your thermal modelling by helping you build accurate thermal models of chip packages.
Assuming you’ve been using FloTHERM or FloTHERM.PCB without FloTHERM.PACK I guess I first need convince you about why you should bother. To help me do that I’d like to introduce you to the concept … Read More
Tags:
Thermal Model,
DELPHI Model,
2-Resistor Model,
IC Packaging,
Thermal Headroom,
FloTHERM.PACK,
FloTHERM.PCB
Posted Oct 8, 2009, by John Parry
Hmmm…
If you’re guessing it’s a chip package, you’re right – got it in one. Well done!
OK, so what type of package is it?
If you’re thinking it’s a silly question as you don’t know anything about the package, other than I’ve told you its black - that was a hint that it’s an encapsulated plastic part by the way - you’d be right.
You’d need me to tell you if it had leads, and if so on how many sides … Read More
Tags:
JEDEC,
Thermal Guideline,
CFD,
Chip Package,
2-Resistor Model,
Thermal Standard,
FloTHERM.PACK,
IC Packaging,
DELPHI Model,
Electronics Cooling
