Posted May 20, 2010, by Robin Bornoff
Sometimes the ability to apply artistic interpretation of your virtual product to your simulation model of it is limited or dictated (take your pick) by the available capabilities of that simulation tool. CFD simulation is quite a young technology, application to electronics cooling newer still, a mere 21 years old. Always pushing the limit of available computing resource, always adapting to the ever … Read More
Tags:
modelling,
compact model,
Electronics Cooling,
BCI,
Model,
Modeling,
Fan
Posted Dec 7, 2009, by Robin Bornoff
Like a river this blog series is slowing down due to its increased width and depth, that and a lot of travel on my part. So, let’s get it back on track! The previous blog focussed on the relatively well known 2 resistor compact thermal model (CTM) method, its strengths (simple to measure and describe) and its deficiencies (unconfirmed and inconsistent accuracy for different package styles and operating … Read More
Tags:
Thermal Resistor,
Accuracy,
BCI,
2R,
Package Model,
Delphi,
Electronics Cooling
Posted Nov 8, 2009, by Robin Bornoff
Next stop on the avenue of package thermal modelling is 2 resistor CTMs (compact thermal models). Specifically Theta_jb and Theta_jc, the thermal resistance between junction and board and junction and case respectively. Unlike their lowly 1R cousins these two resistances do not purport to include the effects of the package environment (well almost not) as such they should in theory be more BCI (boundary … Read More
Tags:
BCI,
CTM,
2R,
Thermal Resistor,
Electronics Cooling
