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Mechanical Analysis Blog

Posts tagged with 'calibration'

19 Apr, 2013

Robin Bornoff In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is modelled explicitly, no abstraction into a thermal resistor equivalent model, no hiding all the proprietary design information inside either. Pros and cons of detailed models I covered a few years ago in this blog. Packaged ICs are complex, constructed of many parts, with many different material … Read More

calibration, Package Model, T3ster

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