Posted Jan 4, 2010, by Robin Bornoff
This series, despite being somewhat lengthy, is by no means a complete overview of the various methods, options and approaches to predicting component temperatures. Here is some stuff I didn’t cover…
My bias in this series is towards the prediction of component temperature via simulation using a 3D CFD approach adopted in our (as ever) market leading FloTHERM and FloTHERM.PCB products. 3D CFD is not … Read More
Tags:
Electronics Cooling,
Component,
T3ster,
Network,
Psi
Posted Dec 17, 2009, by Robin Bornoff
On the sliding scale of thermal component model representation king of all is a ‘detailed’ model. A 3D definition of all of the internal construction geometry and material properties does away with any of the accuracy inconsistency issues associated with the derived CTM (thermal resistor network type) approach.
Despite the fact that all models are wrong a detailed model representation of a package … Read More
Tags:
Detailed,
Electronics Cooling,
Component,
Thermal Resistor,
Package Model
Posted Oct 12, 2009, by Robin Bornoff
Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM (compact thermal model) representation. Here we’ll … Read More
Tags:
Thermal Resistor,
CTM,
Electronics Cooling,
Component,
SPICE,
Thermal Resistance,
IBIS
Posted Oct 9, 2009, by Robin Bornoff
Prediction of component temperatures is central to electronics cooling simulation, the management of their temperatures is central to electronics cooling design. Either way, heat is dissipated inside a component, component gets hot, if component gets too hot, component stops working. When creating an electronics cooling simulation model the question of how to thermally represent the components is key.
The … Read More
Tags:
Component,
Electronics Cooling,
CFD
