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Mechanical Analysis Blog

Posts tagged with 'DynTIM'

25 Jan, 2013

Robin Bornoff The temperature rise that electronic components attain in operation is due to 3 things. The power that they dissipate, the ambient temperature surrounding the product and the various thermal bottlenecks that the heat passes through on its journey from the source to the ambient. An accurate simulation requires all 3 aspects to be modelled correctly. In terms of the bottlenecks, conductive resistance … Read More

DynTIM, thermal conductivity, TIM

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