Mechanical Analysis Blog

Posts tagged with 'Expedition'

Minimizing Late Stage PCB Respins

Posted Jul 20, 2010, by Nazita Saye

In a recent survey, 60% of mechanical engineers in electronics companies stated that thermal issues had forced board layout changes during the previous 12 months. While I can’t purport to know how much respins cost within every organization, I’m willing to bet it is not an insignificant amount – especially if the company has a large portfolio. But I know that thermal simulation can help minimize the … Read More

Tags: Respin, Thermal Design, board-level, Boardstation, Allegro, Expedition, FloTHERM PCB, CR5000, Design Engineer

It's a 3D World - Just watch Avatar

Posted Jan 6, 2010, by John Isaac

Wow!   Have you seen Avatar in 3D?     This movie adds a whole new meaning to 3D.  And sometimes we forget that the rest of the world is 3D including the product that electronics industry companies design.   So why do we sometimes limit our design capabilities to only consider the 2D aspects of the PCB?  Certainly the mechanical design MCAD world has gone mostly 3D. In a viewpoint I wrote for PCD&F … Read More

Tags: Electronics Industry, Expedition, 3D, MCAD, Mechanical Design, FloEFD