Mechanical Analysis Blog

‘Rubbish In -> Rubbish Out’ is a well accepted fact in the world of simulation. Regardless of the technical capabilities of your thermal simulation tool, the accuracy of prediction will always be tightly coupled to the accuracy of the input data. The most accurate thermal  IC package model is a so called ‘detailed’ model where all the internal construction is represented explicitly … Read More

Electronics Cooling, detailed thermal IC package models, T3ster, FloTHERM PACK, strucutre functions

Is common sense all that common? If it were, people wouldn’t cause gridlock (if you can’t clear the intersection, wait on your side of the intersection. Easy.).  If the red light is out, treat it as a stop sign – everyone gets a chance, traffic moves smoothly and everyone eventually crosses the intersection safely. Hmmm… can you tell traffic was especially nasty on the way to work today? Anyway, we’re … Read More

Physical Prototype, Integrated Device Technology, semiconductor packaging, design change, Design Process, cost, FloTHERM PACK, IDT, ECO, engineering change orders

If you are involved with semiconductor packaging design, then have I got news for you. We just announced the availability of FloTHERM IC – a web-based tool that delivers a high level of automation to design tasks associated with full-spectrum thermal characterization and validation. From what I understand, a typical semiconductor thermal team spends about 60% of their time on standard package thermal … Read More

Semiconductor, ROI, Smart Parts, CFD, BGA Substrates, Thermal Characterization, JEDEC, Package Design, Validation, FloTHERM IC, FloTHERM PACK