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Mechanical Analysis Blog

Posts tagged with 'IBIS'

12 Oct, 2009

Robin Bornoff Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM (compact thermal model) representation. Here we’ll … Read More

Thermal Resistor, CTM, Component, SPICE, IBIS

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