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So, you want to predict component temperatures do you? Part II

Posted Oct 12, 2009, by Robin Bornoff

Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM (compact thermal model) representation. Here we’ll … Read More

Tags: Thermal Resistor, CTM, Electronics Cooling, Component, SPICE, Thermal Resistance, IBIS

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More Than Two Decades and Still Going Strong; FloTHERM and FloVENT V9.3 Now Released
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