Sign In
Forgot Password?
Sign In | | Create Account

Mechanical Analysis Blog

Posts tagged with 'IC Package'

4 Mar, 2010

Robin Bornoff

Electronics cooling involves ensuring that IC package temperatures do not exceed maximum rated values. If they do the probability of thermo-mechanical related failure increases dramatically. The accuracy of any electronics thermal simulation will be determined by how well the IC package is represented in the solution. These are simple and evident truths. As the leading supplier of electronic thermal

Read More

FloTHERM IC, IC Package, Electronics Cooling


Online Chat