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Mechanical Analysis Blog

Posts tagged with 'IC Package'

4 Mar, 2010

Robin Bornoff Electronics cooling involves ensuring that IC package temperatures do not exceed maximum rated values. If they do the probability of thermo-mechanical related failure increases dramatically. The accuracy of any electronics thermal simulation will be determined by how well the IC package is represented in the solution. These are simple and evident truths. As the leading supplier of electronic thermal … Read More

FloTHERM IC, IC Package, Electronics Cooling, Thermal Resistance

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