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Posts tagged with 'IC Package'

IC package representation is central to Electronics Cooling

Posted Mar 4, 2010, by Robin Bornoff

Electronics cooling involves ensuring that IC package temperatures do not exceed maximum rated values. If they do the probability of thermo-mechanical related failure increases dramatically. The accuracy of any electronics thermal simulation will be determined by how well the IC package is represented in the solution. These are simple and evident truths. As the leading supplier of electronic thermal … Read More

Tags: FloTHERM IC, IC Package, Electronics Cooling, Thermal Resistance

Impossible Made Possible
Hockey Puck Aerodynamics
Top 10 Things I Learned From Engineers
Smoke, Smoke, Everywhere?
Agile software development practices in the Mechanical Analysis Division
A Little Goes A Long Way (But A Lot Doesn’t Go Much Further)
Comfy cars
Physician Heal Thyself
More Than Two Decades and Still Going Strong; FloTHERM and FloVENT V9.3 Now Released
Beep, Beep

May, 2012
- Impossible Made Possible
- Hockey Puck Aerodynamics
- Top 10 Things I Learned From Engineers
- Smoke, Smoke, Everywhere?
- Agile software development practices in the Mechanical Analysis Division
- A Little Goes A Long Way (But A Lot Doesn’t Go Much Further)
April, 2012
- Comfy cars
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- More Than Two Decades and Still Going Strong; FloTHERM and FloVENT V9.3 Now Released
- Beep, Beep
- Simulation Software So Simple Even Teenagers Can Use It
March, 2012
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- Earthquake Weather and Other Myths
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February, 2012
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- Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures
January, 2012
- Bottlenecks and Interface Materials; Part 2 - When TIMs Go Bad
- Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point
- Bottlenecks and Interface Materials; Part 1 - Great Thermal Bedfellows
- Is Pipe Insulation Effective?
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November, 2011
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October, 2011
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- PC Overclocking and Aftermarket Modding. Part 1 - When Colour Matters.
- This Old CFD House: Part III
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- We Love FloTHERM V9.2
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- Measuring the real world - at least the thermal properties of semiconductor device packages
- On a wing and a prayer…
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July, 2009
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June, 2009
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May, 2009
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